No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
155 | [Packaging Integration technology seminar] Major technology issue and standard t... | 관리자 | 2022-04-18 | 331 |
154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 356 |
153 | [Packaging Integration Technology Seminar] Semiconductor Packaging Integration T... | 관리자 | 2022-04-18 | 278 |
152 | KICK-OFF workshop for materials and parts development business | 관리자 | 2022-03-23 | 141 |
151 | Ministry of Trade, Industry and Energy Technology Exchange Meeting | 관리자 | 2022-02-10 | 293 |
150 | International em |
관리자 | 2022-01-19 | 369 |
149 | Ph.D Min-su LEE, KPIA awarded the IEC Special Achievement Plaque by KSA and KATS | 관리자 | 2021-12-16 | 154 |
148 | MOU with KAMP | 관리자 | 2021-12-16 | 212 |
147 | Chungbuk Semiconductor Expert Forum in 2021 | 관리자 | 2021-12-13 | 389 |
146 | Electronic Mounting Technology (IEC TC91) Expert Committee | 관리자 | 2021-12-06 | 394 |