Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 126 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 129 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 257 |
| 83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 244 |
| 82 | Advanced Packaging & Substrate / Standardization Seminar | 관리자 | 2021-09-13 | 260 |
| 81 | Signed an agreement to foster strategic human resources with KTR | 관리자 | 2021-09-13 | 116 |
| 80 | MOU with ASMPacific Technology | 관리자 | 2021-09-13 | 123 |
| 79 | Kick-off of ‘Committee for Multi-Purpose radiation accelerator project’ in Ch... | 관리자 | 2021-09-13 | 122 |
| 78 | JDA (Joint Development Agreement) with SIMMTECH CO.,Ltd | 관리자 | 2021-09-13 | 127 |
| 77 | Fraunhofer IZM Meeting | 관리자 | 2021-09-13 | 249 |
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관리자 2021-09-13 Hit 126
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관리자 2021-09-13 Hit 129
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관리자 2021-09-13 Hit 257
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관리자 2021-09-13 Hit 244
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관리자 2021-09-13 Hit 260
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관리자 2021-09-13 Hit 116
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관리자 2021-09-13 Hit 123
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관리자 2021-09-13 Hit 122
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관리자 2021-09-13 Hit 127
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관리자 2021-09-13 Hit 249