Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 136 | Semiconductor Packaging Integration Technology Seminar | 관리자 | 2021-09-15 | 369 |
| 135 | Electronics technology standard seminar | 관리자 | 2021-09-15 | 357 |
| 134 | MOU with KSCM | 관리자 | 2021-09-13 | 144 |
| 133 | IEC TC91 Professional Committee – Zoom | 관리자 | 2021-09-13 | 1,255 |
| 132 | MOU with skydiamond | 관리자 | 2021-09-13 | 138 |
| 131 | MOU with LEO | 관리자 | 2021-09-13 | 138 |
| 130 | Symposium Packaging Integration | 관리자 | 2021-09-13 | 333 |
| 129 | Inter-ministerial KICK-OFF workshop for materials and parts development business | 관리자 | 2021-09-13 | 134 |
| 128 | JDA with IMAGIS, NOVASEMI, ATK | 관리자 | 2021-09-13 | 137 |
| 127 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 373 |
-
관리자 2021-09-15 Hit 369
-
관리자 2021-09-15 Hit 357
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관리자 2021-09-13 Hit 144
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관리자 2021-09-13 Hit 1,255
-
관리자 2021-09-13 Hit 138
-
관리자 2021-09-13 Hit 138
-
관리자 2021-09-13 Hit 333
-
관리자 2021-09-13 Hit 134
-
관리자 2021-09-13 Hit 137
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관리자 2021-09-13 Hit 373