Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 251 | Korea-Japan Experts Meeting for Advanced Packaging Integration R&D Meeting | 관리자 | 2024-02-29 | 75 |
| 250 | MOU, KPIA-RC3DS | 관리자 | 2024-02-29 | 35 |
| 249 | 2024 SMART SMT&PCB ASSEMBLY | 관리자 | 2024-02-26 | 24 |
| 248 | Materials and Parts Development Business Ministry of Trade, Industry and Energy ... | 관리자 | 2024-02-26 | 57 |
| 247 | Advanced electronic packaging technology and market seminar | 관리자 | 2024-02-26 | 83 |
| 246 | Technology market and standard trend seminar by electrical, electronic, and info... | 관리자 | 2024-02-26 | 63 |
| 245 | IEC TC91 Experts meeting | 관리자 | 2024-02-21 | 33 |
| 244 | MOU with ULSAN COLLEGE | 관리자 | 2024-01-30 | 16 |
| 243 | em |
관리자 | 2024-01-16 | 44 |
| 242 | MOU with KTC(Korea Testing Certification Institute) | 관리자 | 2023-12-19 | 73 |
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관리자 2024-02-29 Hit 75
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관리자 2024-02-29 Hit 35
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관리자 2024-02-26 Hit 24
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관리자 2024-02-26 Hit 57
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관리자 2024-02-26 Hit 83
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관리자 2024-02-26 Hit 63
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관리자 2024-02-21 Hit 33
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관리자 2024-01-30 Hit 16
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관리자 2024-01-16 Hit 44
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관리자 2023-12-19 Hit 73