Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 146 | Electronic Mounting Technology (IEC TC91) Expert Committee | 관리자 | 2021-12-06 | 406 |
| 145 | Semiconductor Integrated Packaging technology Seminar ICAE2021_KIEEME | 관리자 | 2021-12-03 | 27 |
| 144 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2021-12-03 | 174 |
| 143 | 2021-2 IEC TC91 International Standard Meeting | 관리자 | 2021-11-24 | 132 |
| 142 | MOU with JPCA | 관리자 | 2021-11-15 | 166 |
| 141 | Advanced Packaging Integration Technology international symposium ('21.11/09-10) | 관리자 | 2021-11-15 | 432 |
| 140 | [Mounting Technology Seminar] 5G&6G Communication Parts and Materials Mounting T... | 관리자 | 2021-10-29 | 399 |
| 139 | MOU with Yole | 관리자 | 2021-10-13 | 169 |
| 138 | MOU with Hanbat University | 관리자 | 2021-09-27 | 159 |
| 137 | MOU with KSCM | 관리자 | 2021-09-27 | 156 |
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관리자 2021-12-06 Hit 406
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관리자 2021-12-03 Hit 27
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관리자 2021-12-03 Hit 174
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관리자 2021-11-24 Hit 132
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관리자 2021-11-15 Hit 166
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관리자 2021-11-15 Hit 432
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관리자 2021-10-29 Hit 399
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관리자 2021-10-13 Hit 169
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관리자 2021-09-27 Hit 159
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관리자 2021-09-27 Hit 156