No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
76 | Korea-Japan Experts Meeting for Advanced Packaging Integration R&D Meeting | 관리자 | 2024-02-29 | 54 |
75 | Materials and Parts Development Business Ministry of Trade, Industry and Energy ... | 관리자 | 2024-02-26 | 45 |
74 | IEC TC91 Experts meeting | 관리자 | 2024-02-21 | 17 |
73 | Inter-Ministerial Workshop on Substrate Material Technology Development Project ... | 관리자 | 2023-11-20 | 111 |
72 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 137 |
71 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 226 |
70 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 214 |
69 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 231 |
68 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 248 |
67 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 241 |