Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 96 | MOU with MICROINSPECTION Co., Ltd. | 관리자 | 2021-09-13 | 126 |
| 95 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd | 관리자 | 2021-09-13 | 129 |
| 94 | MOU with NOWTECH Co., Ltd. | 관리자 | 2021-09-13 | 123 |
| 93 | MOU with FindeaChip Co., Ltd. | 관리자 | 2021-09-13 | 115 |
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 119 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 238 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 128 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 246 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 265 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 126 |
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관리자 2021-09-13 Hit 126
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관리자 2021-09-13 Hit 129
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관리자 2021-09-13 Hit 123
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관리자 2021-09-13 Hit 115
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관리자 2021-09-13 Hit 119
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관리자 2021-09-13 Hit 238
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관리자 2021-09-13 Hit 128
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관리자 2021-09-13 Hit 246
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관리자 2021-09-13 Hit 265
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관리자 2021-09-13 Hit 126