Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 195 | em |
관리자 | 2023-01-19 | 234 |
| 194 | [Inter-departmental workshop for material parts development project] | 관리자 | 2022-12-23 | 134 |
| 193 | 2022 COSD Project Results | 관리자 | 2022-12-22 | 117 |
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 143 |
| 191 | [Mounting Technology Symposium] Semiconductor Convergence Components Mounting Te... | 관리자 | 2022-11-07 | 304 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 230 |
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 121 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 234 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 111 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 227 |
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관리자 2023-01-19 Hit 234
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관리자 2022-12-23 Hit 134
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관리자 2022-12-22 Hit 117
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관리자 2022-11-16 Hit 143
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관리자 2022-11-07 Hit 304
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관리자 2022-11-01 Hit 230
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관리자 2022-10-28 Hit 121
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관리자 2022-10-26 Hit 234
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관리자 2022-10-26 Hit 111
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관리자 2022-10-24 Hit 227