Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 300 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 109 |
| 183 | National Defense Quality Conference | 관리자 | 2022-09-26 | 102 |
| 182 | KPIA, Top 3.3% (AAA grade) in the 22 COSD institutional status report | 관리자 | 2022-09-01 | 111 |
| 181 | JPCA SHOW 2022 REPORT | 관리자 | 2022-08-30 | 115 |
| 180 | international standardization forum operation mid-term meeting | 관리자 | 2022-08-10 | 224 |
| 179 | 2022 COSD(Co-operating Organization for Standards Development) Workshop | 관리자 | 2022-07-25 | 116 |
| 178 | 2022-1 IEC TC91 International Standard Meeting | 관리자 | 2022-07-19 | 146 |
| 177 | [KPIA Seminar] 'Packaging is a key factor in determining semiconductor competiti... | 관리자 | 2022-07-19 | 262 |
| 176 | [KPIA Seminar] Samsung which focuses on semiconductor packaging said, 'WLP will ... | 관리자 | 2022-07-19 | 228 |
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관리자 2022-10-19 Hit 300
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관리자 2022-10-06 Hit 109
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관리자 2022-09-26 Hit 102
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관리자 2022-09-01 Hit 111
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관리자 2022-08-30 Hit 115
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관리자 2022-08-10 Hit 224
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관리자 2022-07-25 Hit 116
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관리자 2022-07-19 Hit 146
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관리자 2022-07-19 Hit 262
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관리자 2022-07-19 Hit 228