Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 225 | Korea-Japan Cooperation meeting | 관리자 | 2023-09-18 | 121 |
| 224 | MOU with MK Chem and Tech | 관리자 | 2023-09-07 | 121 |
| 223 | MOU with TLB | 관리자 | 2023-09-05 | 121 |
| 222 | ASPS 2023, Advanced Semiconductor Packaging Show 2023 | 관리자 | 2023-08-31 | 113 |
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 41 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 253 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 106 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 318 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 268 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 261 |
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관리자 2023-09-18 Hit 121
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관리자 2023-09-07 Hit 121
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관리자 2023-09-05 Hit 121
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관리자 2023-08-31 Hit 113
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관리자 2023-08-29 Hit 41
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관리자 2023-08-28 Hit 253
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관리자 2023-08-16 Hit 106
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관리자 2023-07-28 Hit 318
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관리자 2023-07-28 Hit 268
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관리자 2023-07-27 Hit 261