International Cooperation
International Council
The purpose of this council is to promote a strategic partnership among organizations interested in the total solution for interconnecting, assembling, packaging, mounting, and integrating system design and by increasing global awareness.
To accomplish these objectives, members will cooperatively work: to support standards development at a national or international level, to encourage the development of technology roadmaps, to address environmental issues, and to monitor market trends. These activities will be based on the principles of free enterprise, cooperation, and will be undertaken in a spirit of responsibility to the worldwide electronics industry. *Edited Mission Statement for the Packaging Integration International Council (JIC) by IPC,JEDEC and EIAJ in May, 2000
JIC HISTORY
SEMINAR AND MEETING (FOR THREE THROUGH FIVE DAYS)
- 1999 Preparatory discussion in Kyoto (IEC General Meeting) with Dieter Bergman(IEC/TC91 chair), Martin Freedman(SC47D, chair), JNC members (Katsumi Yamamoto, Hisao Kasuga 외)
- 2000 JIC# 1 Chicago (JNAC)
- 2001 JIC# 2 Okinawa (JJC)
- 2002 JIC# 3 San Francisco (JNAC)
- 2003 JIC# 4 Regensburg (JEC)
- 2004 JIC# 5 Hong Kong (JJC)
- 2005 JIC# 6 Herndon (JNAC)
- 2006 JIC# 7 Berlin (JEC)
- 2007 JIC# 8 Singapore (JJC)
- 2008 JIC# 9 Atlanta (JNAC)
- 2009 JIC#10 Grenoble (JEC)
- 2010 JIC#11 Kyoto (JJC)
- 2011 JIC#12 Maryland (JNAC)
- 2012 JIC#13 Nuremberg (JEC)
- 2013 JIC#14 Seoul (JKC of JEAC)
- 2014 JIC#15 Singapore (JJC)
- 2015 JIC#16 Texas (JNAC)
JIC AFFILIATE
