•2019 JIC 20 Frankfurt, Germany (JEC)

– JIC (Jisso International Council)

– 2019 Spring Meeting May 20th , 2019 (Monday)

– DKE, Frankfurt (Main), Stresemannallee 19, Germany Room Siemens

– 참석 인원: 50여명
– 한국실장산업협회 김현호 협회장이 한국실장기술지원센터 관련하여 발표를 하였으며, 일본에서 JKC RnD 과제의 Embedded Module 개발에 대해서 관심을 많이 가짐.
– 일본 후쿠오카 대학의 카토 교수가 3D embedded 기술을 소개했으며, 본 발표 에서는 Ultra fine RDL 기술, bumping 기술, 임베디드 기술, 개발제품의 전기적 평가 기술 등을 소개함.
– Low Temp. Soldering 재료에 대한 연구 및 Whisker 발표 매카니즘에 대한 연구를 일본에서 소개하였는데, 실장기술 전문가들의 많은 관심을 보임.
– 네드란드 TNO Holst에서 레이저를 활용한 회로 형성 방식을 소개하였는데, printing 기술적인 측면에서 우수할것으로 기대됨. 최소 L/S 50/50um임.
– 독일 Semikron에서 power module에 대한 신뢰성 부분에 대한 HAST 등에 따른 이슈를 소개함. 전장용 모듈의 신뢰성에 대한 대응책에 대한 고려가 필요함.
– 보쉬에서 High power, high density 응용제품에 대해서 소개함. 특히 현재 독일 PCIM council에서 임베디드 파워 모듈에 대한 소개를 함. 하지만 PCB type의 power module에 대한 개발이 높은 온도의 영향으로 쉽지 않은 것으로 보임.
– 유럽의 3D electronics 기술에 대한 session을 진행함. 특히 핀란드 TactoTek의 Injection molded structural electronics 기술을 소개함. 향후 자동차 및 웨어러블 등의 제품 응용에 많이 사용될 것으로 보임.