Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 165 | MOU with KOREA POLYTECHNICS | 관리자 | 2022-05-31 | 147 |
| 164 | MOU with Chungbuk Provincial University | 관리자 | 2022-05-27 | 103 |
| 163 | MOU with FAR EAST UNIVERSITY | 관리자 | 2022-05-23 | 147 |
| 162 | Semiconductor fusion component mounting technology exchange meeting and integrat... | 관리자 | 2022-05-23 | 137 |
| 161 | IPC SummerCom 2022 | 관리자 | 2022-05-23 | 292 |
| 160 | JIC CONFERENCE 2022_SPRING | 관리자 | 2022-05-18 | 244 |
| 159 | MOU with IPITECH | 관리자 | 2022-05-10 | 107 |
| 158 | MOU with KOPEA | 관리자 | 2022-04-25 | 101 |
| 157 | Packaging integration industry de facto standard(IPC) forum Kick-off ceremony | 관리자 | 2022-04-20 | 212 |
| 156 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2022-04-19 | 223 |
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관리자 2022-05-31 Hit 147
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관리자 2022-05-27 Hit 103
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관리자 2022-05-23 Hit 147
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관리자 2022-05-23 Hit 137
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관리자 2022-05-23 Hit 292
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관리자 2022-05-18 Hit 244
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관리자 2022-05-10 Hit 107
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관리자 2022-04-25 Hit 101
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관리자 2022-04-20 Hit 212
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관리자 2022-04-19 Hit 223