No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 240 |
214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 104 |
213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 616 |
212 | Advanced Electronics packaging integration Technology and Market Seminar I | 관리자 | 2023-07-24 | 284 |
211 | MOU with OXWIRES | 관리자 | 2023-07-24 | 104 |
210 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 218 |
209 | Semiconductor Convergence Sensor and Certificate Authority Networking Workshop | 관리자 | 2023-07-03 | 108 |
208 | Participated in the booth at the Summer Conference of the Korean Institute of El... | 관리자 | 2023-06-26 | 98 |
207 | ['23.6.21-22] Symposium on electronic mounting materials | 관리자 | 2023-06-26 | 256 |
206 | KICK-OFF workshop of the Ministry of Trade, Industry and Energy for the developm... | 관리자 | 2023-06-26 | 226 |