[KPIA Seminar]  JPCA-KPIA Semiconductor packaging integration seminar

1. Date : October 14, 2022

2. Venue : Suwon convention center

3. Program :

10:10 – 10:55 / Bonding Technology Trend for Bumps / SK hynix

11:05 – 11:50 / Smaller than MLCC:CCW/ Insulated, Passivated&Adhesively-Promoted Bond Wire Using All-in-One Al2O3 Coating / Samsung electronics

1:00 – 1:45 / Surface Treatment Technologies for Packaging Substrate / MEC

1:55 – 2:40 / Mechanical drilling technology trends for nest-gen FC-BGA package substrate cores / UNION TOOL

2:50 – 3:35 / Hybrid Bonding Process and Equipment Technology Trend / Samsung electronics

3:45 – 4:30 / System semiconductor package substrate key technology / Simmtech

4:40 – 5:25 / Latest heat dissipation material technology trends / SHIN-A T&C