[Packaging Integration Technology Seminar] High-speed Substrate Material Technology Seminar 

1. Date and Time: April 14, 2022 (Thu) 10:00 ~ 16:20

2. Venue: Room 308, COEX

3. Schedule:

10:00 - 10:50 High Speed PCB and Materials / Kaz Hirasaka, Prismark

11:00 - 11:50 Technology Trends in Low-Dielectric Substrated Materials for 5G Devices / Fumito Suzuki, Panasonic

1:00 - 1:30 Low-K FCCL Technology Trend / Team Leader Kim Seong-geun, Innox Advanced Materials

1:30 - 2:20 Low-K Filler Technology Trend / Director Yoo Young-cheol, Seok-Kyung AT

2:30 - 3:20 High Speed Interface Solution / Dr. Youngmae Lee, Samtec

3:30 - 4:20 Technology Trend of Organic-Inorganic Composite Insulation Material for Electronic Board / Dongpil Kang CTO, Top Nano