[Packaging Integration Technology Seminar] Semiconductor Packaging Integration Technology Seminar

1. Date and time: April 13, 2022 (Wednesday) 9:30 ~ 17:00

2. Venue: Room 308, COEX

3. Schedule:

9:30 - 10:20 Novel Materials for Advanced Packaging and System Integration / Dongaki Shangguan, Indium Corporation

10:30 - 11:20 FC BGA technology trends / Tadashi Kamewada, AZ Supply Chain Solutions

11:30 - 12:00 Power Module Packaging Technology / Shalu Agarwal, Yole Development

1:00 - 1:50 Introduction of Smart Vehicle Technology / Director Moon Cheol-woo, Korea Automobile Research Institute

2:00 - 2:50 Low melting temperature (LTS) solder interconnects : Thermo-mechanical stability and degradation mechanism / Dr. Taegyu Lee, Cisco Systems

3:00 - 3:50 B-Stage Polymer Adhesive Films (ACFs, NCFs, and EMFs) for Electronic Packaging Applications / Professor Baek Kyung-wook, KAIST

4:00 - 4:50 Semiconductor packaging technology trends / Henry H. Utsunomiya, Interconnection Tech