Activity
Seminar
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 68 | IEC TC91 JIC, 2026 Spring Meeting | 관리자 | 2026-06-22 | 101 |
| 67 | AI Semiconductor Electronics Packaging Technology Seminar | 관리자 | 2026-06-12 | 93 |
| 66 | Advanced packaging technology for the AI era | 관리자 | 2026-06-05 | 176 |
| 65 | Glass-ba |
관리자 | 2026-06-04 | 175 |
| 64 | Reliability of Future Automotive Semiconductors | 관리자 | 2026-04-02 | 442 |
| 63 | CPO & Glass Advanced Packaging Technology in the AI Era | 관리자 | 2026-04-01 | 1,835 |
| 62 | The Pan Pacific Strategic Electronics Symposium (Pan Pac) | 관리자 | 2026-02-06 | 595 |
| 61 | ICAE 2025_Session 14. Advanced packaging & substrate | 관리자 | 2025-11-25 | 939 |
| 60 | IPC K-FEST 2025 | 관리자 | 2025-11-04 | 915 |
| 59 | TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 2 | 관리자 | 2025-08-28 | 999 |
-
관리자 2026-06-22 Hit 101
-
관리자 2026-06-12 Hit 93
-
관리자 2026-06-05 Hit 176
-
관리자 2026-06-04 Hit 175
-
관리자 2026-04-02 Hit 442
-
관리자 2026-04-01 Hit 1,835
-
관리자 2026-02-06 Hit 595
-
관리자 2025-11-25 Hit 939
-
관리자 2025-11-04 Hit 915
-
관리자 2025-08-28 Hit 999