Activity
Seminar
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 73 | SMTA International 2026, KPIA Korea Session | 관리자 | 2026-10-28 | 91 |
| 72 | Glass Advanced Packaging Technology for AI Era_08.27. | 관리자 | 2026-08-27 | 270 |
| 71 | Glass Advanced Packaging Technology for AI Era_08.26. | 관리자 | 2026-08-26 | 254 |
| 70 | Future Vehicle Semiconductors and Components Training on Reliability Technology | 관리자 | 2026-08-06 | 220 |
| 69 | IEC TC WG Meeting | 관리자 | 2026-06-27 | 198 |
| 68 | IEC TC91 JIC, 2026 Spring Meeting | 관리자 | 2026-06-22 | 1,191 |
| 67 | AI Semiconductor Electronics Packaging Technology Seminar | 관리자 | 2026-06-12 | 574 |
| 66 | Advanced packaging technology for the AI era | 관리자 | 2026-06-05 | 782 |
| 65 | Glass-ba |
관리자 | 2026-06-04 | 546 |
| 64 | Reliability of Future Automotive Semiconductors | 관리자 | 2026-04-02 | 759 |
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관리자 2026-10-28 Hit 91
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관리자 2026-08-27 Hit 270
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관리자 2026-08-26 Hit 254
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관리자 2026-08-06 Hit 220
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관리자 2026-06-27 Hit 198
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관리자 2026-06-22 Hit 1,191
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관리자 2026-06-12 Hit 574
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관리자 2026-06-05 Hit 782
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관리자 2026-06-04 Hit 546
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관리자 2026-04-02 Hit 759