ICAE 2025_Session 14.  Advanced packaging & substrate / multi-dimensional circuit tech

ICAE : International Conference on Advanced Electromaterials (첨단전자재료국제학술대회)

- Date & Venue : 2025.11.25-28, ICC JEJU

- Session 14. Advanced packaging & substrate / multi-dimensional circuit tech

Session 14 Substrate, and Multi-dimensional Circuit Technologies

251126-1 Multi-Materials 3D Printing with Functional Inks for Structural Electronics

251126-2 3D-Printed PTFE Substrates for High-Frequency RF Applications: Design, Fabrication, and Characterization 

251126-3 Fabrication of Large-Scale, Multilayered, Stretchable Circuits 

251126-4 A Self-Healing Ionic Hydrogel Capacitive Sensors for Motion-Responsive Monitoring

251126-5 Bilayer-Engineered Magnetically Aligned Ferromagnetic Particle VIAs for Stretchable Electronics Applications 

251127-1 Room Temperature Welding of Silver Nanowires for Flexible Transparent Conductive Electrodes with Hydrochloric acid 

251127-2 Intel Foundry Advanced Packaging and Test Solutions for AI and HPC

251127-3 Micro-Interconnects Trends in Semiconductor Packaging

251127-4 Functionalization of Si-Ge Heterojunction Semiconductor Nanowires for Novel Transistor Channels

251127-5 Readiness of Advanced AI Packages

251127-6 New Wave of Low-Temperature Solder for Electronics Packaging

251127-7 Microstructural Characteristics according to Filling Behavior of Organic Additive assisted Cu Electrodeposition in Microvia 

251127-8 Silane Treatment of Wafer Surfaces and NCF Adhesion for Enhanced Semiconductor Packaging Reliability

251127-9 Low-Energy Nanosecond Laser Annealing for Selective High-Temperature Treatment of Metal Interconnects

251127-10 Direct Cu-Pin Mounting Technology for Advanced Packaging

251127-11 Trend of Polymeric Dielectric Materials for Advanced Packaging

251127-12 Development of a High Aspect Ratio Cu-Pin Bonding Process Using 3D-Printed Masks for Fine Pitch Interconnects

251127-13 Synthesis and Thermal Characterization of a BPA-Derived Benzoxazine Thermoset Exhibiting Low Coefficient of Thermal

251127-14 Fabrication of the Multilayer Circuits for Space Transformer of NAND Probe Card Using Trenched Circuit Trace on Polyimide Film and Sinterable Metal Paste Filling  Expansion

251128-1 Advancing Computational Techniques for Designing Low-Dielectric Polymers

251128-2 Development of High-Performance Low-Dielectric Polyimide Materials via Free Volume Engineering

251128-3 Synthesis of Photocurable Side-chain Engineered Polyimide with Low Dielectric Properties 

251128-4 Introduction to Multiscale Analysis Techniques for Fracture Toughness and Thermal Conductivity of Polymer Nanocomposites

251128-5 High Thermal Conductivity AlN/PDMS Composites Fabricated via Liquid Metal 

251128-6 Hierarchical Assembly of Silver Micro/Nano Hybrid Structures toward Low Temperature Sintering for Die Attach Applications

251128-7 Enhancement of Thermal Conductivity and Reduction of Interfacial Thermal Resistance in Ga-Based TIM Using Ti-Coated Diamond Particles

251128-8 Derivation of Effective Thermal Conductivity of Porous Ag Sintered Structure: Relationship Between Pore Morphology and Heat Transfer Pathways 

251128-9 Ni Mesh-Integrated CIP/BN/TPU Composites for Thermal Management and EMI Shielding

251128-10 Development of High-Thermal-Conductivity Epoxy Systems Using Aromatic Crystalline Curing Agents for Advanced Semiconductor Thermal Management

251128-11 Synthesis and Characterization of Low Molecular Weight Poly(phenylene ether) 1-3308 with Low Dielectric Constant for Advanced Electronic Applications