Wednesday, February 4

Session 4: Korea Packaging Integration Association
Session Chairs: Yoonchul Son, Chosun University & Hyunho Kim, KPIA 

Compare Reliability of BGA Package with Different Soldering Processes:
Reflow Soldering vs IPL Soldering
Seung-Boo Jung, Sungkyunkwan University 

Cu/SiO₂ Hybrid Bonding: Dielectric Interface Strengthening and Cu Oxide Suppression
Sungdong Kim, Seoul National University of Science and Technology

Ion Beam Etching as a Disruptive Integration Strategy for Advanced Logic:
From T2T Scaling to Tilted 3D-IC Routing
Jongsoon Park, Sungkyunkwan University

Graphene-Based Multilayer Composites as a Promising Solution for Next-Generation EUV Pellicles
Yun Sung Woo, Dankook University