Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 353 | IEC TC91 Expert Meeting_260828 | 관리자 | 2026-08-28 | 145 |
| 352 | 2026 Advanced Semiconductor Packaging&Chiplet Show | 관리자 | 2026-08-28 | 78 |
| 351 | Glass Advanced Packaging Technology for AI Era_08.27. | 관리자 | 2026-08-27 | 152 |
| 350 | Glass Advanced Packaging Technology for AI Era_08.26. | 관리자 | 2026-08-26 | 138 |
| 349 | Future Vehicle Semiconductors and Components Training on Reliability Technology | 관리자 | 2026-08-06 | 122 |
| 348 | Glass Material Standard Developmet Kick-off Meeting | 관리자 | 2026-07-16 | 145 |
| 347 | IC Substrate Material IPC Kick-off Meeting | 관리자 | 2026-07-16 | 91 |
| 346 | IEC TC WG Meeting | 관리자 | 2026-06-27 | 80 |
| 345 | IEC TC91 JIC, 2026 Spring Meeting | 관리자 | 2026-06-22 | 1,089 |
| 344 | The 15th Smart Tech Korea (STK 2026) | 관리자 | 2026-06-12 | 80 |
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관리자 2026-08-28 Hit 145
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관리자 2026-08-28 Hit 78
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관리자 2026-08-27 Hit 152
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관리자 2026-08-26 Hit 138
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관리자 2026-08-06 Hit 122
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관리자 2026-07-16 Hit 145
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관리자 2026-07-16 Hit 91
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관리자 2026-06-27 Hit 80
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관리자 2026-06-22 Hit 1,089
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관리자 2026-06-12 Hit 80