Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 291 | SMTA KOREA AG Technical Committee | 관리자 | 2025-02-24 | 77 |
| 290 | Package substrates technology experts meeting for 2.1D Packaging | 관리자 | 2025-02-24 | 72 |
| 289 | 2025 SMTA Wafer Level Packaging Symposium | 관리자 | 2025-02-19 | 77 |
| 288 | 2025 em |
관리자 | 2025-01-20 | 79 |
| 287 | 2024 COSD Performance Sharing Meeting | 관리자 | 2024-12-20 | 176 |
| 286 | Burn-in-Board R&D experts workshop | 관리자 | 2024-12-11 | 202 |
| 285 | Inter-Ministry Workshop on the Development of Substrate Materials Technology for ... | 관리자 | 2024-12-09 | 195 |
| 284 | Training program for semiconductor packaging engineers | 관리자 | 2024-12-05 | 206 |
| 283 | General meeting and conference of the de facto standardization forum | 관리자 | 2024-12-04 | 199 |
| 282 | KPDFIA-KPIA business cooperation | 관리자 | 2024-11-29 | 209 |
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관리자 2025-02-24 Hit 77
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관리자 2025-02-24 Hit 72
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관리자 2025-02-19 Hit 77
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관리자 2025-01-20 Hit 79
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관리자 2024-12-20 Hit 176
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관리자 2024-12-11 Hit 202
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관리자 2024-12-09 Hit 195
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관리자 2024-12-05 Hit 206
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관리자 2024-12-04 Hit 199
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관리자 2024-11-29 Hit 209