Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 344 | IEC TC91 JIC, 2026 Spring Meeting | 관리자 | 2026-06-22 | 918 |
| 343 | AI Semiconductor Electronics Packaging Technology Seminar | 관리자 | 2026-06-12 | 343 |
| 342 | JPCA SHOW 2026 CO-EXHIBITION | 관리자 | 2026-06-12 | 297 |
| 341 | Advanced packaging technology for the AI era | 관리자 | 2026-06-05 | 481 |
| 340 | Glass-ba |
관리자 | 2026-06-04 | 365 |
| 339 | Technology Standards Experts Meeting | 관리자 | 2026-04-03 | 574 |
| 338 | IEC TC91 Expert Meeting_260403 | 관리자 | 2026-04-03 | 602 |
| 337 | Reliability of Future Automotive Semiconductors | 관리자 | 2026-04-02 | 624 |
| 336 | CPO & Glass Advanced Packaging Technology in the AI Era | 관리자 | 2026-04-01 | 2,169 |
| 335 | 2026 Smart SMT & PCB Assembly (SSPA 2026) | 관리자 | 2026-04-01 | 287 |
-
관리자 2026-06-22 Hit 918
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관리자 2026-06-12 Hit 343
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관리자 2026-06-12 Hit 297
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관리자 2026-06-05 Hit 481
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관리자 2026-06-04 Hit 365
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관리자 2026-04-03 Hit 574
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관리자 2026-04-03 Hit 602
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관리자 2026-04-02 Hit 624
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관리자 2026-04-01 Hit 2,169
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관리자 2026-04-01 Hit 287