No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
90 | SMTA KOREA AG Technical Committee | 관리자 | 2025-02-24 | 77 |
89 | Package substrates technology experts meeting for 2.1D Packaging | 관리자 | 2025-02-24 | 72 |
88 | 2024 COSD Performance Sharing Meeting | 관리자 | 2024-12-20 | 176 |
87 | Burn-in-Board R&D experts workshop | 관리자 | 2024-12-11 | 202 |
86 | Inter-Ministry Workshop on the Development of Substrate Materials Technology for ... | 관리자 | 2024-12-09 | 194 |
85 | General meeting and conference of the de facto standardization forum | 관리자 | 2024-12-04 | 199 |
84 | COSD Electrical and electronics division workshop | 관리자 | 2024-11-25 | 203 |
83 | De facto, International Standards Forum_IPC Committee | 관리자 | 2024-08-29 | 368 |
82 | BIB PCB FABRICATION RND PROJECT WS | 관리자 | 2024-07-18 | 817 |
81 | Substrate Materials Technology Development Project for High-Speed CCL - Wor... | 관리자 | 2024-07-08 | 549 |