About Us
KPIA History
2025
| Jan. 20 | 2025 embedding technology - JISSO Information sharing forum |
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| Feb. 14 | MOU with SIPC |
| Feb. 18-20 | 2025 SMTA Wafer Level Packaging Symposium |
| Feb. 24 | SMTA KOREA AG Technical Committee |
| Feb. 24 | Package substrates technology experts meeting for 2.1D Packaging |
| Apr. 2 | Advanced Electronic Packaging Technology and Market Seminar - 1 |
| Apr. 3 | Advanced Electronic Packaging Technology and Market Seminar - 2 |
| Apr. 4 | SMTA Korea Alliance Group Technical Committee Kick-off |
| Apr. 4 | " IEC TC91 Expert Committee_250404" |
| May 16 | 2025 Semiconductor Convergence Council Kickoff Meeting |
| May 20 | Meeting on Reliability Verification Center Project for Future Automotive Semicon... |
| May 21-22 | Burn-in-Board R&D experts workshop |
| May 22-23 | Chungbuk Semiconductor experts networking workshop |
| Jun. 12 | IEC TC91 (Electronics Assembly Technology) Experts Committee |
| Jun. 12 | KPIA Advanced Electronic Assembly Technology Seminar |
| Jun. 13 | SMTA KR AG Technical Committee Symposium |
| Jun. 19 | 2025 Semiconductor Convergence Council 2nd Meeting |
| Jun. 25 | MOU with Astrotek |
| Jun. 27 | MOU with CM Partner |
| Jul. 9-31 | MOU with GIGA Lane, Art Lab, Innometri and NNFC |
2024
| Jan. 15 | Embedding 2024 - JISSO Information sharing forum |
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| Jan. 30 | MOU with Ulsan National University of Science |
| Feb. 21 | Seminar on Advanced Electronics Technology, Market and Standards |
| Feb. 21 | IEC TC91 (Electronic Assembly Technology) Expert Committee |
| Feb. 21-23 | 2024 SMART SMT&PCB ASSEMBLY |
| Feb. 22 | Advanced Packaging Technology and Market Seminar |
| Feb. 29 | Korea-Japan Joint Technology Development of Advanced Packaging Electronics |
| Feb. 29 | MOU, KPIA-Japan 3D Semiconductor Research Center |
| Mar. 26-27 | Workshop on Substrate Material R&D for High-Speed Communication |
| Apr. 25 | Advanced Packaging Technology and Market Seminar I |
| Apr. 25-26 | 2024 Korea Electronics Manufacturing Exhibition (EMK2024) |
| Apr. 26 | Advanced Packaging Technology and Market Seminar II |
| May 17 | MOU with HKPCA |
| May 9 | MOU with SMTA |
| Jun. 10 | 2024 JISSO International Council Conference |
| Jun. 10-14 | 2024 IEC TC91 International Conference |
| Jun. 12-14 | JPCA SHOW 2024 Participation |
| Jun. 19-21 | 2024 GSC Global Supply Chain show |
| Jun. 20 | IEC TC91 Expert Committee |
| Jun. 20 | Seminar on Advanced Packaging Technology, Market and Standards |
| Jun. 24-26 | KIEEME Summer Conference |
| Jun. 25 | Workshop on Substrate Material R&D for High-Speed Communication |
| Jul. 16-17 | Substrate Materials R&D Workshop for Burn-in-board |
| Jul. 4 | Workshop on Substrate Material R&D for High-Speed Communication |
| Aug. 28-30 | ASPS Semiconductor Packaging Industry Exhibition |
| Aug. 29 | De facto international Standards forum |
| Sep. 12, Sep. 24 | MOU with Daeduck electronics and Alpha global |
| Aug. 26 | Daedeok Electronics Signs MOU With Alpha Global, Chosun University |
| Aug. 30 | Advanced Packaging Technology and Market Seminar |
| Sep. 25, Sep. 23 | MOU with Kyungshin cable and Nofion |
| Oct. 29 | IPC K-FEST 2024 |
| Oct. 29 | 2024 Gangwon Semiconductor Forum |
| Oct. 2 | MOU with Hallym Puritech |
| Oct. 31 | MOU with ISIG |
| Nov. 25 | COSD Electrical and Electronic Council Workshop |
| Nov. 28-Dec. 12 | Semiconductor Packaging Employee Training |
| Nov. 29 | KPIA-KPDIA Power Semiconductor Business Cooperation |
| Dec. 10-11 | Workshop on Substrate Material R&D for High-Speed Communication |
| Dec. 20 | 2024 COSD Performance Sharing Meeting |
| Dec. 4 | General meetings and conferences of the de facto standardization forum |
| Dec. 4-5 | Workshop on Substrate Material R&D for High-Speed Communication |
2023
| July. 27 | Seminar on Technology and Standard Trends by Electronic Field |
|---|---|
| July. 20-21 | Advanced Electronic Packaging integration Technology Summer Seminar |
| July. 19 | LAB Technical Committee/IECTC91 Expert Committee |
| July. 19 | Electronic Assembly IPC Standards Forum Expert / Steering Committee |
| June. 29-30 | Semiconductor convergence sensor and certification authority networking |
| June. 21-22 | KIEEME Summer Conference and exhibition |
| June. 21-22 | Electronic Packaging integration Materials Symposium |
| Apr. 20-21 | KICK-OFF workshop for materials development project |
| Apr. 13 | De facto International Standard (IPC) Forum Expert Committee |
| Apr. 13 | IEC TC91 Expert Committee |
| Apr. 12-14 | Korea Electronics Manufacturing Exhibition, EMK 2023 |
| Apr. 12-14 | Industry 4.0: Seminar on Electronics Packaging industry |
| Mar. 31 | IPC Forum Steering Committee |
| Feb. 23 | KICK-OFF workshop for MOTIE project |
| Jan. 16 | Embedding tech expert meeting in Korea, Germany, Japan and Taiwan |
| July. 28 | IPC Forum Steering Committee |
| Aug. 17 | MOU with TLB |
| Aug. 24-25 | Interministerial workshop of low-k material R&D |
| Aug. 25 | MOU with MK Chem&Tech |
| Aug. 29 | MOU with CMP |
| Aug. 30 | ASPS 2023 exhibition |
| Sep. 11 | Korea & Japan Semiconductor Packaging integration Tech mtg |
| Sep. 25 | 2023 COSD a regylar meeting |
| Oct. 24 | Technology Market and Standard Seminar by Electronics Industry |
| Oct. 25 | KPIA Packaging Integration Seminar Ⅰ |
| Oct. 26 | KPIA Packaging Integration Seminar Ⅱ |
| Oct. 25-27 | Semiconductor Exhibition 2023 |
| Oct. 27 | Electronic Assembly IPC Standards Forum Expert / Steering Committee |
| Oct. 27 | MOU with TONGMYONG UNIVERSITY |
| Oct. 31-Nov. 03 | International Conference on Advanced Elctromaterals 2023 |
| Nov. 01-03 | Intermatioal Symposium on Semiconductor Packaging integration |
| Nov. 06-10 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting |
| Nov. 11 | MOU with PCEA. Printed Circuit Engineering Association |
| Nov. 16 | Interministerial workshop of low-k material technology development |
| Dec. 18 | MOU with IEEC(Integrated Electronics Engineering Center) |
| Dec. 19 | MOU with KTC(Korea Testing Certification Institute) |
2022
| Dec. 21 | 2022 COSD performance sharing event |
|---|---|
| Nov. 10 | Inter-departmental workshop for material parts development project |
| Nov. 03 | Semiconductor Packaging integration technology symposium |
| Oct. 27 | Observation of substrate manufacturing site visit |
| Oct. 26 | Korea Electronics Show KES 2021 |
| Oct. 26 | 2022 Semiconductor Expert Forum |
| Oct. 21 | MOU with EV advanced materials for business cooperation |
| Oct. 21 | De facto standard (IPC) forum expert committee |
| Oct. 14 | KPIA-JPCA Electronic Packaging integration Technology Seminar |
| Oct. 06 | Standards Development Cooperation Agency (COSD) Workshop |
| Sep. 27 | Business cooperation MOU with BK Electronics |
| Sep. 22 | De facto standard IPC seminar in electronic Packaging integration field |
| Sep. 22 | IEC TC91 (Electronic Assembly Technology) Expert Committee |
| Sep. 21 | Introduction of low-k material technology development |
| Sep. 21 | National Defense Quality Conference - Presentation of research status |
| Sep. 16 | Technology Exchange Meeting - Commercialization Planning Meeting |
| Sep. 01 | COSD agency status report; Acquired the highest AAA rating |
| Aug. 25 | Inter-departmental workshop for materials development project |
| Aug. 09 | De facto international standardization forum midterm meeting |
| July. 28 | Technology Exchange Meeting - Technology Business Planning Meeting |
| July. 21 | COSD(Co-operating Organization for Standards Development) Workshop |
| July. 15 | Semiconductor component material technology seminar |
| July. 14 | Semiconductor Packaging integration Technology Seminar |
| June. 22 | Packaging integration technology symposium |
| June. 16 | R&D standard project cooperation agency by KSA |
| June. 10 | IPC Standards Forum Steering Committee |
| June. 09 | The 2nd workshop for CCL materials development project |
| June. 08 | IEC TC91 (Electronic Assembly Technology) Expert Committee |
| June. 08 | MOU with IPC for business cooperation |
| June. 02 | MOU with Chungbuk Health Science University |
| May. 27 | MOU with Chungbuk Provincial University |
| May. 23 | MOU with Far East University for business cooperation |
| May. 19 | Electronics Packaging integration technology exchange meeting |
| May. 17 | JIC Conference 2022_Spring |
| May. 12 | MOU with Korea Polytechnics for business cooperation |
| May. 07 | IPC SummerCom 2022 Expert Exchange Meeting |
| Apr. 19 | MOU with Korea Flexible Electronics Industry Association |
| Apr. 15 | Inauguration Ceremony for standard Forum in the IEC TC91 |
| Apr. 15 | IEC TC91 Expert Committee |
| Apr. 15 | Major technology and standard trends by electronic field |
| Apr. 14 | Component material technology seminar for high-speed transmission |
| Apr. 13 | Korea Electronics Manufacturing Exhibition, EMK 2022 |
| Apr. 13 | Semiconductor Packaging integration Technology Seminar |
| Mar. 17 | KICK-OFF workshop for material development project |
| Mar. 08 | MOU with IPITECH for business cooperation |
| Feb. 09 | Material Development Project Meeting |
| Jan. 17 | Embedding Technology Korea-Germany-Japan Conference |
2021
| Dec. 15 | Awarded in IEC Executive Special Achievement Plaque |
|---|---|
| Dec. 09 | 2021 Chungbuk Semiconductor Expert Forum |
| Dec. 08 | MOU for CCL materials development project |
| Dec. 03 | MOU with Tongmyong University |
| Dec. 01 | IEC TC91 Expert Committee |
| Nov. 09 | Int'l Symposium on Electronics Packaging Integration |
| Nov. 02 | CCL materials development project meeting |
| Oct. 28 | 5G&6G communication device tech seminar |
| Oct. 25 | MOU with KAMP(The Korean Association of Microelectronics Packaging) |
| Oct. 13 | MOU with JPCA(Japan Electronics Packaging and Circuits Association) |
| Sep. 02 | MOU with Hanbat University |
| August 03 | MOU with KSCM |
| July 30 | Intelligent semiconductor technology seminar |
| July 29 | Electronic technology standard seminar |
| July 29 | IEC TC91 Professional Committee |
| July 20 | MOU with skydiamond |
| July 15 | MOU with LEO |
| June 30 | Symposium Packaging Integration |
| June 24 | Inter-ministerial KICK-OFF workshop for materials and parts development business |
| June 10 | JDA with IMAGIS, NOVASEMI, ATK |
| June 11 | Packaging Integration Technology Conference |
| June 03 | Material parts development business KICK-OFF workshop |
| June 02 | MOU with metasite |
| May 07 | Packaging Integration Technology Conference |
| April 22 | IEC TC91 Professional Committee |
| April 22 | Semiconductor technology seminar |
| April 7 | MOU with RPS |
| April 6 | Chungbuk Semiconductor Industry Council |
| April 2 | MOU with KFAIRS |
| March 31 | Development project planning 2nd meeting |
| March 19 | The 2nd Electronic Technology Council in 2021 |
| March 04 | MOU with MSW |
| March 03 | Development project planning meeting |
| February 04 | LCG(Liaison Coordination Group)Meeting |
| February 01 | MOU with Hansol |
| January 25 | Fraunhofer IZM meeting |
| January 07 | MOU with Reed K. Fairs |
2020
| December 08 | IEC TC91 Professional Committee |
|---|---|
| November 5 | Symposium Packaging Integration |
| October 29 | Intelligent semiconductor technology seminar |
| October 28 | Electronic technology seminar |
| October 08 | Electronic technology standard seminar |
| October 08 | IEC TC91 Professional Committee |
| September 25 | Intelligent Semiconductor Technology Conference |
| September 07 | Semiconductor technology equipment development meeting |
| September 03 | MOU with SANICO CO., Ltd. |
| September 02 | Standard Expert Meeting |
| September 01 | MOU with KIEEME |
| August 25 | MOU with MICROINSPECTION CO., Ltd. |
| August 21 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd |
| August 12 | Intelligent Semiconductor Technology Conference |
| August 03 | MOU with NOWTECH CO.,Ltd |
| July 29 | MOU with FindeaChip CO.,Ltd |
| July 27 | MOU with ibest |
| July 24 | IEC TC91 Professional Committee |
| July 08 | Symposium Packaging Integration |
| July 08 | Semiconductor Packaging Center promotion |
| June 18 | JKC technical committee |
| June 18 | COSD signboard hanging ceremony |
| May 22 | IEC TC91 Professional Committee |
| May 22 | Advanced Packaging/Standardization Seminar |
| May 20 | Signed an agreement to foster strategic human resources with KTR |
| April 24 | MOU with ASMPacific Technology |
| March 30 | Committee for the Promotion of Multi-Purpose radiation accelerator in Chungcheong Appointment |
| March 11 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd |
| March 11 | Co-operation Organization for Standards Development(COSD) |
| January 20 | Fraunhofer IZM Berlin Meeting |
| January 13 | MOU with POINT IMAGE |
| January 10 | MOU with HANBIT TECHNOLOGY |
2019
| December 05 | MOU with IACF Chosun University |
|---|---|
| November 28 | JIC JEAF and Experts Steering Meeting |
| November 06 | Amkor Technology Seminar |
| October 10 | Automotive Technology Experts Meeting |
| September 26 | Packaging Integration Experts Workshop |
| September 20 | MOU with KPCA |
| October 03 | MOU with SILICON INSIDE CO., Ltd. |
| August 28 | MOU with MORIAH KOREA |
| June 17 | MOU with JESAGI HANKOOK Co., Ltd. |
| June 03 | MOU with Seongsan High Tech Co., Ltd. |
| May 28 | MOU with YMT Co., Ltd. |
| May 14 | JKC technical experts meeting |
| April 15 | MOU with HOJIN Platech Co., Ltd. |
| April 04 | A Ground-breaking of Jisso Center |
| April 04 | JKC technical experts meeting |
| April 03 | FOP,SiC,Packaging Technology Seminar |
| February 20 | MOU with Cheongju University IACF |
| February 08 | MOU with NEPES CO., Ltd. |
| January 30 | MOU with GDS CO., Ltd. |
| January 29 | MOU with FLUKE KOREA CO., Ltd. |
| January 28 | MOU with COMS CO., Ltd. |
| January 14 | Fraunhofer IZM Berlin Meeting |
2018
| December 29 | IoT, 5G, PLP Technical SEMINAR |
|---|---|
| October 25 | Jisso Int'l Council Busan Conference |
| October 23 | LCG and JIC(Jisso_Int'l_Council) meeting |
| October 16 | MOU with SUN SEMICONDUCTOR |
| September 17 | The 2nd JKC Technical Experts Committee |
| September 10 | MOU with SAEHAN TECH |
| September 10 | MOU with TAMURA CHEMICAL KOREA |
| September 10 | MOU with S&C WISE HOLDINGS |
| September 10 | MOU with AT&S KOREA |
| August 28, | The 1st JKC Technical SEMINAR |
| August 14 | MOU with MAEUL SOFT CO., LTD. |
| July 27 | The 1st JKC Technical Experts Committee |
| July 20 | MOU with Sungkyunkwan University RIC |
| July 13 | MOU with MOAS |
| July 12 | MOU with EPSOL |
| July 06 | MOU with NAMCHON |
| July 03 | MOU with TERRANICS |
| April 13 | MOU with ITEK Semiconductor |
| April 02 | MOU with WAYNICSs |
2017
| September 13 | MOU with TheONE Science |
|---|---|
| August 24 | MOU with I-ASSET |
| July 31 | Chairperson accepted in Marquis Who’s Who World |
| July 31 | MOU with GIGAVIS |
| July 04 | MOU with CONNECTEC JAPAN |
| March 30 | MOU with CHUNGBUK Nat'l University RBDF |
| February 15 | MOU with OSAN University |
| February 02 | MOU with KETI |
| January 18~20 | NEPCON JAPAN with Nidec and SIMMTECH |
| January 16 | MOU with DAEDUCK ELECTRONICS |
| January 13 | MOU with KPU-HPJRC |
2016
| December 21 | Adv. Commtt for Semicon convergence Device |
|---|---|
| December 02 | Governmental RnD Project Planning |
| June 30 | NDA with ATsemicon |
| April | NDA Contract with NEPESJune |
| April | MOU with P&M TECH |
| March | BIZ COOPERATION with 2HKT |
| March | MOU with ADVANTEST KOREA |
| March | JDA with SIMMTECH, CBTP, NIDEC |
| January 01 | Jisso Industry Council Meeting in Japan |
2015
| December 05 | Korea Jisso Industry Council Established |
|---|---|
| October 24 | Jisso International Council Meeting in China |