2024
Jan. 15 | Embedding 2024 - JISSO Information sharing forum |
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2023
July. 27 | Seminar on Technology and Standard Trends by Electronic Field |
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July. 20-21 | Advanced Electronic Packaging integration Technology Summer Seminar |
July. 19 | LAB Technical Committee/IECTC91 Expert Committee |
July. 19 | Electronic Assembly IPC Standards Forum Expert / Steering Committee |
June. 29-30 | Semiconductor convergence sensor and certification authority networking |
June. 21-22 | KIEEME Summer Conference and exhibition |
June. 21-22 | Electronic Packaging integration Materials Symposium |
Apr. 20-21 | KICK-OFF workshop for materials development project |
Apr. 13 | De facto International Standard (IPC) Forum Expert Committee |
Apr. 13 | IEC TC91 Expert Committee |
Apr. 12-14 | Korea Electronics Manufacturing Exhibition, EMK 2023 |
Apr. 12-14 | Industry 4.0: Seminar on Electronics Packaging industry |
Mar. 31 | IPC Forum Steering Committee |
Feb. 23 | KICK-OFF workshop for MOTIE project |
Jan. 16 | Embedding tech expert meeting in Korea, Germany, Japan and Taiwan |
July. 28 | IPC Forum Steering Committee |
Aug. 17 | MOU with TLB |
Aug. 24-25 | Interministerial workshop of low-k material R&D |
Aug. 25 | MOU with MK Chem&Tech |
Aug. 29 | MOU with CMP |
Aug. 30 | ASPS 2023 exhibition |
Sep. 11 | Korea & Japan Semiconductor Packaging integration Tech mtg |
Sep. 25 | 2023 COSD a regylar meeting |
Oct. 24 | Technology Market and Standard Seminar by Electronics Industry |
Oct. 25 | KPIA Packaging Integration Seminar Ⅰ |
Oct. 26 | KPIA Packaging Integration Seminar Ⅱ |
Oct. 25-27 | Semiconductor Exhibition 2023 |
Oct. 27 | Electronic Assembly IPC Standards Forum Expert / Steering Committee |
Oct. 27 | MOU with TONGMYONG UNIVERSITY |
Oct. 31-Nov. 03 | International Conference on Advanced Elctromaterals 2023 |
Nov. 01-03 | Intermatioal Symposium on Semiconductor Packaging integration |
Nov. 06-10 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting |
Nov. 11 | MOU with PCEA. Printed Circuit Engineering Association |
Nov. 16 | Interministerial workshop of low-k material technology development |
Dec. 18 | MOU with IEEC(Integrated Electronics Engineering Center) |
Dec. 19 | MOU with KTC(Korea Testing Certification Institute) |
2022
Dec. 21 | 2022 COSD performance sharing event |
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Nov. 10 | Inter-departmental workshop for material parts development project |
Nov. 03 | Semiconductor Packaging integration technology symposium |
Oct. 27 | Observation of substrate manufacturing site visit |
Oct. 26 | Korea Electronics Show KES 2021 |
Oct. 26 | 2022 Semiconductor Expert Forum |
Oct. 21 | MOU with EV advanced materials for business cooperation |
Oct. 21 | De facto standard (IPC) forum expert committee |
Oct. 14 | KPIA-JPCA Electronic Packaging integration Technology Seminar |
Oct. 06 | Standards Development Cooperation Agency (COSD) Workshop |
Sep. 27 | Business cooperation MOU with BK Electronics |
Sep. 22 | De facto standard IPC seminar in electronic Packaging integration field |
Sep. 22 | IEC TC91 (Electronic Assembly Technology) Expert Committee |
Sep. 21 | Introduction of low-k material technology development |
Sep. 21 | National Defense Quality Conference - Presentation of research status |
Sep. 16 | Technology Exchange Meeting - Commercialization Planning Meeting |
Sep. 01 | COSD agency status report; Acquired the highest AAA rating |
Aug. 25 | Inter-departmental workshop for materials development project |
Aug. 09 | De facto international standardization forum midterm meeting |
July. 28 | Technology Exchange Meeting - Technology Business Planning Meeting |
July. 21 | COSD(Co-operating Organization for Standards Development) Workshop |
July. 15 | Semiconductor component material technology seminar |
July. 14 | Semiconductor Packaging integration Technology Seminar |
June. 22 | Packaging integration technology symposium |
June. 16 | R&D standard project cooperation agency by KSA |
June. 10 | IPC Standards Forum Steering Committee |
June. 09 | The 2nd workshop for CCL materials development project |
June. 08 | IEC TC91 (Electronic Assembly Technology) Expert Committee |
June. 08 | MOU with IPC for business cooperation |
June. 02 | MOU with Chungbuk Health Science University |
May. 27 | MOU with Chungbuk Provincial University |
May. 23 | MOU with Far East University for business cooperation |
May. 19 | Electronics Packaging integration technology exchange meeting |
May. 17 | JIC Conference 2022_Spring |
May. 12 | MOU with Korea Polytechnics for business cooperation |
May. 07 | IPC SummerCom 2022 Expert Exchange Meeting |
Apr. 19 | MOU with Korea Flexible Electronics Industry Association |
Apr. 15 | Inauguration Ceremony for standard Forum in the IEC TC91 |
Apr. 15 | IEC TC91 Expert Committee |
Apr. 15 | Major technology and standard trends by electronic field |
Apr. 14 | Component material technology seminar for high-speed transmission |
Apr. 13 | Korea Electronics Manufacturing Exhibition, EMK 2022 |
Apr. 13 | Semiconductor Packaging integration Technology Seminar |
Mar. 17 | KICK-OFF workshop for material development project |
Mar. 08 | MOU with IPITECH for business cooperation |
Feb. 09 | Material Development Project Meeting |
Jan. 17 | Embedding Technology Korea-Germany-Japan Conference |
2021
Dec. 15 | Awarded in IEC Executive Special Achievement Plaque |
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Dec. 09 | 2021 Chungbuk Semiconductor Expert Forum |
Dec. 08 | MOU for CCL materials development project |
Dec. 03 | MOU with Tongmyong University |
Dec. 01 | IEC TC91 Expert Committee |
Nov. 09 | Int'l Symposium on Electronics Packaging Integration |
Nov. 02 | CCL materials development project meeting |
Oct. 28 | 5G&6G communication device tech seminar |
Oct. 25 | MOU with KAMP(The Korean Association of Microelectronics Packaging) |
Oct. 13 | MOU with JPCA(Japan Electronics Packaging and Circuits Association) |
Sep. 02 | MOU with Hanbat University |
August 03 | MOU with KSCM |
July 30 | Intelligent semiconductor technology seminar |
July 29 | Electronic technology standard seminar |
July 29 | IEC TC91 Professional Committee |
July 20 | MOU with skydiamond |
July 15 | MOU with LEO |
June 30 | Symposium Packaging Integration |
June 24 | Inter-ministerial KICK-OFF workshop for materials and parts development business |
June 10 | JDA with IMAGIS, NOVASEMI, ATK |
June 11 | Packaging Integration Technology Conference |
June 03 | Material parts development business KICK-OFF workshop |
June 02 | MOU with metasite |
May 07 | Packaging Integration Technology Conference |
April 22 | IEC TC91 Professional Committee |
April 22 | Semiconductor technology seminar |
April 7 | MOU with RPS |
April 6 | Chungbuk Semiconductor Industry Council |
April 2 | MOU with KFAIRS |
March 31 | Development project planning 2nd meeting |
March 19 | The 2nd Electronic Technology Council in 2021 |
March 04 | MOU with MSW |
March 03 | Development project planning meeting |
February 04 | LCG(Liaison Coordination Group)Meeting |
February 01 | MOU with Hansol |
January 25 | Fraunhofer IZM meeting |
January 07 | MOU with Reed K. Fairs |
2020
December 08 | IEC TC91 Professional Committee |
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November 5 | Symposium Packaging Integration |
October 29 | Intelligent semiconductor technology seminar |
October 28 | Electronic technology seminar |
October 08 | Electronic technology standard seminar |
October 08 | IEC TC91 Professional Committee |
September 25 | Intelligent Semiconductor Technology Conference |
September 07 | Semiconductor technology equipment development meeting |
September 03 | MOU with SANICO CO., Ltd. |
September 02 | Standard Expert Meeting |
September 01 | MOU with KIEEME |
August 25 | MOU with MICROINSPECTION CO., Ltd. |
August 21 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd |
August 12 | Intelligent Semiconductor Technology Conference |
August 03 | MOU with NOWTECH CO.,Ltd |
July 29 | MOU with FindeaChip CO.,Ltd |
July 27 | MOU with ibest |
July 24 | IEC TC91 Professional Committee |
July 08 | Symposium Packaging Integration |
July 08 | Semiconductor Packaging Center promotion |
June 18 | JKC technical committee |
June 18 | COSD signboard hanging ceremony |
May 22 | IEC TC91 Professional Committee |
May 22 | Advanced Packaging/Standardization Seminar |
May 20 | Signed an agreement to foster strategic human resources with KTR |
April 24 | MOU with ASMPacific Technology |
March 30 | Committee for the Promotion of Multi-Purpose radiation accelerator in Chungcheong Appointment |
March 11 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd |
March 11 | Co-operation Organization for Standards Development(COSD) |
January 20 | Fraunhofer IZM Berlin Meeting |
January 13 | MOU with POINT IMAGE |
January 10 | MOU with HANBIT TECHNOLOGY |
2019
December 05 | MOU with IACF Chosun University |
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November 28 | JIC JEAF and Experts Steering Meeting |
November 06 | Amkor Technology Seminar |
October 10 | Automotive Technology Experts Meeting |
September 26 | Packaging Integration Experts Workshop |
September 20 | MOU with KPCA |
October 03 | MOU with SILICON INSIDE CO., Ltd. |
August 28 | MOU with MORIAH KOREA |
June 17 | MOU with JESAGI HANKOOK Co., Ltd. |
June 03 | MOU with Seongsan High Tech Co., Ltd. |
May 28 | MOU with YMT Co., Ltd. |
May 14 | JKC technical experts meeting |
April 15 | MOU with HOJIN Platech Co., Ltd. |
April 04 | A Ground-breaking of Jisso Center |
April 04 | JKC technical experts meeting |
April 03 | FOP,SiC,Packaging Technology Seminar |
February 20 | MOU with Cheongju University IACF |
February 08 | MOU with NEPES CO., Ltd. |
January 30 | MOU with GDS CO., Ltd. |
January 29 | MOU with FLUKE KOREA CO., Ltd. |
January 28 | MOU with COMS CO., Ltd. |
January 14 | Fraunhofer IZM Berlin Meeting |
2018
December 29 | IoT, 5G, PLP Technical SEMINAR |
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October 25 | Jisso Int'l Council Busan Conference |
October 23 | LCG and JIC(Jisso_Int'l_Council) meeting |
October 16 | MOU with SUN SEMICONDUCTOR |
September 17 | The 2nd JKC Technical Experts Committee |
September 10 | MOU with SAEHAN TECH |
September 10 | MOU with TAMURA CHEMICAL KOREA |
September 10 | MOU with S&C WISE HOLDINGS |
September 10 | MOU with AT&S KOREA |
August 28, | The 1st JKC Technical SEMINAR |
August 14 | MOU with MAEUL SOFT CO., LTD. |
July 27 | The 1st JKC Technical Experts Committee |
July 20 | MOU with Sungkyunkwan University RIC |
July 13 | MOU with MOAS |
July 12 | MOU with EPSOL |
July 06 | MOU with NAMCHON |
July 03 | MOU with TERRANICS |
April 13 | MOU with ITEK Semiconductor |
April 02 | MOU with WAYNICSs |
2017
September 13 | MOU with TheONE Science |
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August 24 | MOU with I-ASSET |
July 31 | Chairperson accepted in Marquis Who’s Who World |
July 31 | MOU with GIGAVIS |
July 04 | MOU with CONNECTEC JAPAN |
March 30 | MOU with CHUNGBUK Nat'l University RBDF |
February 15 | MOU with OSAN University |
February 02 | MOU with KETI |
January 18~20 | NEPCON JAPAN with Nidec and SIMMTECH |
January 16 | MOU with DAEDUCK ELECTRONICS |
January 13 | MOU with KPU-HPJRC |
2016
December 21 | Adv. Commtt for Semicon convergence Device |
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December 02 | Governmental RnD Project Planning |
June 30 | NDA with ATsemicon |
April | NDA Contract with NEPESJune |
April | MOU with P&M TECH |
March | BIZ COOPERATION with 2HKT |
March | MOU with ADVANTEST KOREA |
March | JDA with SIMMTECH, CBTP, NIDEC |
January 01 | Jisso Industry Council Meeting in Japan |
2015
December 05 | Korea Jisso Industry Council Established |
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October 24 | Jisso International Council Meeting in China |