<TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 2>

1.Date and Time: Thursday, August 28, 2025, 10:00 AM - 5:00 PM

2. Venue: Suwon Convention Center, Rooms 202 and 203

3. Schedule:

10:00 – 10:40 / Trends and Challenges in Advanced Semiconductor Packaging Technology / Jaeseong Lim, Group Leader / HANA MICRON

10:50 – 11:30  / Power and Thermal Management in Advanced Chiplet-Based Packaging / Youngdo Kwon, Sr. Director / Amkor Technology

11:35 – 12:00 / Silicon-Based Thermal Test Vehicles for Semiconductor Thermal Management / Dongkai Shangguan CEO / TEA

13:10 – 13:40 / Trends in Advanced Semiconductor Packaging Technology / Professor Yooncheol Son / CHOSUN UNIVERSITY

13:50 – 14:20 / Development of Photoresist (PR) for Glass Packages / Yongil Kim, Managing Director / ycchem

14:30 – 15:00 / Novel electrodeposition technology for advanced packaging / Professor Bong-Young Yoo / HANYANG UNIVERITY

15:10 – 15:40 / Glass substrate & interposer manufacturing equipment solutions / Seok-Jong Yoo, Vice President / SCHMID

15:50 – 16:20 / Semiconductor substrate technology and market / Kaz Hirasaka, Analyst / PRISMARK

16:30 – 17:00 / Power Electronics for Data Centers 2025 / Hassan Cheaito, Analyst / YOLE