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국제협력

국제실장포럼

JIC Conference 2022

관리자 2022-07-12 조회수 103


JIC presentation 2022
Tuesday, 17th May
No. Presentation title Presenter NC Estimated time
Opening of the meeting Dr. Masahide Okamoto 5 min
1 Conformal coating with ALD for space and medical applications; PCB & Assembly protection Marko Pudas, Picosun Oy FI 30 min
2 Thermal management-related Dr. Tomoyuki Hatakeyama
Dr. Kazuaki Sanada
Dr. Takashi Fukue
JP 30 min
3 Impacts and challenges of AME, from design to data Michael Schleicher DE 30 min
4 Package Substrate by Reel-to-Reel Processes Dr. Byun, Jungsoo
Senior Managing Director
HAESUNG DS  
KR 40 min
Break   5 min
5 Advanced semiconductor package Prof. Dr. Yoshihisa Katoh JP 30 min
6 Laser-based Manufacturing of Electronic Layers Dr. Christian Vedder DE 30 min
7 USA-JISSO Update 2022 - Efforts and Plans for dvanced Electronics Packaging Mr. Dennis Fritz US 30 min
Closing remarks Dr. Udo Welzel 10 min