IEC TC91 JIC (Jisso International Council), 2023 Spring Meeting
June 5th, 2023 (Monday), SESKO Scandic hotel; Helsinki, Finland Room Mansku
Target
The conference is an opportunity for researches, manufacturers and standardization group members to meet, share and discuss the future of assembly technologies and applications.
Program
Time |
|
Title |
Speaker |
|
|
Opening Session |
|||
9:00 |
FIN |
Opening Remarks |
Arto Sirviö, Chairman
Finnish National Committee SESKO |
|
9:15 |
FIN |
TC91 Mirror Committee
Finland |
Vesa Vuorinen, Finnish
Committee chair |
|
|
Technical Sessions |
|||
9:30 |
1JNC |
Electrical 3D printer for
rapid PCB manufacturing by fully additive low temperature process |
Ryojiro Tominaga / FUJI
Corporation, Japan |
|
10:00 |
2JNC |
Product
planning/development and its challenges from the perspective of social
implementation of decarbonized substrates by new manufacturing method |
Takashi
NAKASHIMA / Elephantech Inc., Japan |
|
10:30 |
3FIN |
Additive manufacturing in
Electronics |
Dr. Amit Tewari,
post-doctoral researcher, Tampere University |
|
|
11:00-11:20 Networking coffee
break |
|||
11:20 |
4GER |
Harsh Environment/HV/PCB |
Walter Olbrich, TTM |
|
11:45 |
5KOR |
Process and Materials for
Laser- Assisted Bonding (LAB) |
YoonChul Son, Professor, Chosun University Korea |
|
12:10 |
6JNC |
Thermal Management of
Electronics Components on Composite Printed Circuit Board (temporary title) |
Dr. Tomoyuki Hatakeyama,
Dr. Kazuaki Sanada, Dr. Takashi Fukue |
|
|
12:35-13:30 Lunch break at xxx |
|||
13:30 |
8FIN |
ESG: Environment Nokia |
Pia Tanskanen, Nokia |
|
14:00 |
9GER |
Sustainability |
Wolfgang Nüchter(AE/OSU), Bosch, Germany |
|
14:30 |
10FIN |
Sustainability /
Ecodesign |
Mervi Paulasto-Kröckel,
Professor at Aalto University, Finland |
|
|
15:00-15:30 Networking coffee
break |
|||
15:30 |
11FIN |
Sensor technology and sustainability |
Anne Mäkiranta, Forciot,
Finland |
|
15:50 |
12FIN |
IMSE technology and sustainability |
Outi Rusanen, Tactotek |
|
16:10 |
13CN |
Technology Breakthrough
of A Degradable and Recyclable Copper Clad Laminate for Sustainability |
Jianwei Cai,SYTECH, China |
|
16:30 |
14 |
Chips act - US |
Dennis Frizt |
|
17:00 |
|
The risk prediction of electrochemical migration
on electronic control units |
Dr. Udo Welzel, Bosch |
|
17:30 |
|
Wrap up and closing |
Dr. Udo Welzel, Bosch |
|