| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 91 | Package substrates technology experts meeting for 2.1D Packaging | 관리자 | 2025-02-24 | 1,044 |
| 90 | 2024 COSD Performance Sharing Meeting | 관리자 | 2024-12-20 | 1,056 |
| 89 | R&D Workshop for Low Dk & Df material and Semiconductor BIB(Burn-In-Board) test ... | 관리자 | 2024-12-11 | 1,118 |
| 88 | R&D Workshop on the Development of Substrate Materials Technology for Ultra-High-... | 관리자 | 2024-12-09 | 1,153 |
| 87 | General meeting and conference of the de facto standardization forum | 관리자 | 2024-12-04 | 1,093 |
| 86 | COSD Electrical and electronics division workshop | 관리자 | 2024-11-25 | 1,045 |
| 85 | IEC TC 91 FALL MEETING 2024 | 관리자 | 2024-09-30 | 674 |
| 84 | De facto, International Standards Forum_IPC Committee | 관리자 | 2024-08-29 | 1,189 |
| 83 | R&D mtg for Low Dk & Df material and Semiconductor BIB(Burn-In-Board) test | 관리자 | 2024-07-18 | 1,613 |
| 82 | BIB(Burn-In-Board) Workshop ; Low Dk & Df materials for BIB | 관리자 | 2024-07-16 | 570 |