Activity
Meeting
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 70 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 834 |
| 69 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 845 |
| 68 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 850 |
| 67 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 903 |
| 66 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 799 |
| 65 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 837 |
| 64 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 805 |
| 63 | KICK-OFF workshop of the Ministry of Trade, Industry and Energy for the developm... | 관리자 | 2023-06-26 | 728 |
| 62 | Inter-departmental KICK-OFF workshop for material parts development project | 관리자 | 2023-04-24 | 876 |
| 61 | IEC TC91 de facto standard(IPC) forum experts meeting | 관리자 | 2023-04-17 | 814 |
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관리자 2023-10-31 Hit 834
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관리자 2023-10-31 Hit 845
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관리자 2023-08-28 Hit 850
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관리자 2023-07-28 Hit 903
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관리자 2023-07-27 Hit 799
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관리자 2023-07-27 Hit 837
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관리자 2023-07-19 Hit 805
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관리자 2023-06-26 Hit 728
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관리자 2023-04-24 Hit 876
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관리자 2023-04-17 Hit 814