Activity
Meeting
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 70 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 684 |
| 69 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 694 |
| 68 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 704 |
| 67 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 752 |
| 66 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 655 |
| 65 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 691 |
| 64 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 659 |
| 63 | KICK-OFF workshop of the Ministry of Trade, Industry and Energy for the developm... | 관리자 | 2023-06-26 | 589 |
| 62 | Inter-departmental KICK-OFF workshop for material parts development project | 관리자 | 2023-04-24 | 730 |
| 61 | IEC TC91 de facto standard(IPC) forum experts meeting | 관리자 | 2023-04-17 | 669 |
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관리자 2023-10-31 Hit 684
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관리자 2023-10-31 Hit 694
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관리자 2023-08-28 Hit 704
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관리자 2023-07-28 Hit 752
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관리자 2023-07-27 Hit 655
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관리자 2023-07-27 Hit 691
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관리자 2023-07-19 Hit 659
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관리자 2023-06-26 Hit 589
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관리자 2023-04-24 Hit 730
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관리자 2023-04-17 Hit 669