Activity
Meeting
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 73 | IEC TC91 Experts meeting | 관리자 | 2024-02-21 | 575 |
| 72 | Inter-Ministerial Workshop on Substrate Material Technology Development Project ... | 관리자 | 2023-11-20 | 509 |
| 71 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 562 |
| 70 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 586 |
| 69 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 604 |
| 68 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 603 |
| 67 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 641 |
| 66 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 560 |
| 65 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 589 |
| 64 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 559 |
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관리자 2024-02-21 Hit 575
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관리자 2023-11-20 Hit 509
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관리자 2023-11-10 Hit 562
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관리자 2023-10-31 Hit 586
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관리자 2023-10-31 Hit 604
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관리자 2023-08-28 Hit 603
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관리자 2023-07-28 Hit 641
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관리자 2023-07-27 Hit 560
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관리자 2023-07-27 Hit 589
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관리자 2023-07-19 Hit 559