-THURSDAY, November 2

13:30~14:00 B-Stage Conductive Adhesive Films(ACFs and NCFs) Materials for Electronics Pacakging Applications

14:00~14:30 Potential of Low Temperature Soldering Using Hypoeutectic Sn-Bi Alloys

14:30~15:00 The Reactions between Gallium and Under Bump Metallizations on Printed Circuit Boards

15:00~15:30 Thermal Engineerign Using Photonic Structures

15:30~15:45 Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding

15:45~16:00 AI203-Coated Bond Wire for Adhesion Promoter & Electrical Insulation

-FRIDAY, November 3

09:00~09:30 The Materials for the Advanced Pakcage Technology

09:30~10:00 Reliability Mitigation of Substrates for 2.5D Packages and High Performance Computing

10:00~10:30 Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension in Non-Conductive Film(NCF)

10:45~11:15 Electronic Device Technologies for mm-Wave/Thz Applications Using Special Packaging Materials:Research Overview and Possibility

11:15~11:45 Tehcnology Trends in Materials for HIgh Speed PCB

11:45~12:15 Development and Standard Trend of PCB Low Dielectric Material for High-Speed Communication

13:30~14:00 The Global Trend of Battery Testing

14:00~14:30 Research Trends on the Design of a Multilayer Radar Absorbing Structure