반도체융합부품 차세대 패키지기술연구지원 거점확보를 위한 ‘반도체실장기술센터(사진)’가 완공됐다.
47종 55대 공동연구장비 갖춰 차세대 패키지기술 중점 지원

‘Semiconductor Packaging Integration Technology Center’ (photo) has been completed to secure a base for research on next-generation package technology for semiconductor convergence components.
47 types and 55 joint research equipments service for industry to focus on next-generation package technology