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협회활동

공지사항

실장기술 온라인 세미나 개최_JIC Conference

관리자 2021-09-02 조회수 69

한국실장산업협회에서는 국제실장협의회(JIC) 온라인 세미나를 개최하오니, 관심 있는 회원의 신청을 바랍니다. (선착순 50명)

※등록(클릭) 전에 회원 여부를 확인 바랍니다. => 회원 확인 후 줌 링크 발송함

->비회원의 참가 희망 시는 개인회원가입서를 작성하여 메일 회신(첨부)

JIC Conference registration

20:00-20:05/5′ KNC – Opening Hyunho Kim / KPIA-JKC

20:05-20:30 /25′ JNC 1 JEITA Jisso Activities in Japan Ryoji Ninomiya / Toshiba Electronic Devices & Storage Corporation

20:30-20:45/15′ JNC 2 Whisker and related JISSO Material in JEITA standardization Group Ichizo Sakamoto / S.C.L

20:45-21:15 /30′ KNC 3 Introduction and application of laser assisted bonding (LAB) Yoonchul Sohn / Chosun University

21:15-21:35 /20′ GNC 4 Advances and Challenges in Additively Manufactured Electronics (AME) Devices from design to data Jaim Nulman / NanoDimension

21:35-21:55 /20′ GNC 5 Disruptive approach in the design and tool chain of additively manufactured circuit boards Michael Schleicher / Semikron

21:55-22:10 /15′ JNC 6 Revision of IEC61760-3 Ed1 : “Surface mounting technology of through-hole reflow(THR) soldering. ” and “Guidelines for through hole diameter design with solder paste surface printing method.” Chiko Yorita / Hitachi, Ltd

22:10-22:35 /25′ JNC 7 Changes in thermal management caused by progress in surface mount technology Takashi Fukue / Kanazawa institute of technology

22:35-22:40 /5′ GNC – Closing Udo Welzel / Robert Bosch GmbH