[실장기술세미나] 반도체융합부품 실장기술 세미나
1. 일 시 : 2022년 4월 13일(수) 9:30 ~ 17:00
2. 장 소 : 코엑스 308호
3. 일 정 :
9:30 - 10:20 Novel Materials for Advanced Packaging and System Integration / Dongaki Shangguan, Indium Corporation
10:30 - 11:20 FC BGA technology trends / Tadashi Kamewada, AZ Supply Chain Solutions
11:30 - 12:00 Power Module Packaging Technology / Shalu Agarwal, Yole Development
1:00 - 1:50 Introduction of Smart Vehicle Technology / 문철우 센터장, 한국자동차연구원
2:00 - 2:50 Low melting temperature (LTS) solder interconnects : Thermo-mechanical stability and degradation mechanism / 이태규 박사, Cisco Systems
3:00 - 3:50 B-Stage Polymer Adhesive Films(ACFs, NCFs, and EMFs) for Electronic Packaging Applications / 백경욱 교수, KAIST
4:00 - 4:50 Semiconductor packaging technology trends / Henry H. Utsunomiya, Interconnection Tech