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국제실장포럼

JIC Conference 2022

관리자 2022-10-10 Number of views 39


JIC presentation 2022
Tuesday, 17th May
No.Presentation titlePresenterNCEstimated time
Opening of the meetingDr. Masahide Okamoto5 min
1Conformal coating with ALD for space and medical applications; PCB & Assembly protectionMarko Pudas, Picosun OyFI30 min
2Thermal management-relatedDr. Tomoyuki Hatakeyama
Dr. Kazuaki Sanada
Dr. Takashi Fukue
JP30 min
3Impacts and challenges of AME, from design to dataMichael SchleicherDE30 min
4Package Substrate by Reel-to-Reel ProcessesDr. Byun, Jungsoo
Senior Managing Director
HAESUNG DS  
KR40 min
Break 5 min
5Advanced semiconductor packageProf. Dr. Yoshihisa KatohJP30 min
6Laser-based Manufacturing of Electronic LayersDr. Christian VedderDE30 min
7USA-JISSO Update 2022 - Efforts and Plans for dvanced Electronics PackagingMr. Dennis FritzUS30 min
Closing remarksDr. Udo Welzel10 min