Time

Title

Speaker

Opening Session

9:00

FIN

Opening Remarks

Arto Sirviö, Chairman Finnish National Committee SESKO

9:15

FIN

TC91 Mirror Committee Finland

Vesa Vuorinen, Finnish Committee chair

Technical Sessions

9:30

1JNC

Electrical 3D printer for rapid PCB manufacturing by fully additive low temperature process

Ryojiro Tominaga / FUJI Corporation, Japan

10:00

2JNC

Product planning/development and its challenges from the perspective of social implementation of decarbonized substrates by new manufacturing method

Takashi NAKASHIMA / Elephantech Inc., Japan

10:30

3FIN

Additive manufacturing in Electronics

Dr. Amit Tewari, post-doctoral researcher, Tampere University

11:00-11:20                       Networking coffee break

11:20

4GER

Harsh Environment/HV/PCB

Walter Olbrich, TTM

11:45

5KOR

Process and Materials for Laser- Assisted Bonding (LAB)

YoonChul Son, Professor,

Chosun University Korea

12:10

6JNC

Thermal Management of Electronics Components on Composite Printed Circuit Board (temporary title)

Dr. Tomoyuki Hatakeyama, Dr. Kazuaki Sanada, Dr. Takashi Fukue

12:35-13:30                        Lunch break  at xxx

13:30

8FIN

ESG: Environment Nokia

Pia Tanskanen, Nokia

14:00

9GER

Sustainability

Wolfgang Nüchter(AE/OSU), Bosch, Germany

14:30

10FIN

Sustainability / Ecodesign

Mervi Paulasto-Kröckel, Professor at Aalto University, Finland

15:00-15:30                         Networking coffee break

15:30

11FIN

Sensor technology and sustainability

Anne Mäkiranta, Forciot, Finland

15:50

12FIN

IMSE technology and sustainability

Outi Rusanen, Tactotek

16:10

13CN

Technology Breakthrough of A Degradable and Recyclable Copper Clad Laminate for Sustainability

Jianwei Cai,SYTECH, China

16:30

14

Chips act - US

Dennis Frizt

17:00

The risk prediction of electrochemical migration on electronic control units

Dr. Udo Welzel, Bosch

17:30

Wrap up and closing

Dr. Udo Welzel, Bosch