Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 288 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 532 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 242 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 491 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 648 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 268 |
| 183 | National Defense Quality Conference | 관리자 | 2022-09-26 | 240 |
| 182 | KPIA, Top 3.3% (AAA grade) in the 22 COSD institutional status report | 관리자 | 2022-09-01 | 263 |
| 181 | JPCA SHOW 2022 REPORT | 관리자 | 2022-08-30 | 246 |
| 180 | international standardization forum operation mid-term meeting | 관리자 | 2022-08-10 | 492 |
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관리자 2022-10-28 Hit 288
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관리자 2022-10-26 Hit 532
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관리자 2022-10-26 Hit 242
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관리자 2022-10-24 Hit 491
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관리자 2022-10-19 Hit 648
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관리자 2022-10-06 Hit 268
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관리자 2022-09-26 Hit 240
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관리자 2022-09-01 Hit 263
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관리자 2022-08-30 Hit 246
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관리자 2022-08-10 Hit 492