Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 212 | Advanced Electronics packaging integration Technology and Market Seminar I | 관리자 | 2023-07-24 | 937 |
| 211 | MOU with OXWIRES | 관리자 | 2023-07-24 | 422 |
| 210 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 848 |
| 209 | Semiconductor Convergence Sensor and Certificate Authority Networking Workshop | 관리자 | 2023-07-03 | 680 |
| 208 | Participated in the booth at the Summer Conference of the Korean Institute of El... | 관리자 | 2023-06-26 | 419 |
| 207 | ['23.6.21-22] Symposium on electronic mounting materials | 관리자 | 2023-06-26 | 1,335 |
| 206 | KICK-OFF workshop of the Ministry of Trade, Industry and Energy for the developm... | 관리자 | 2023-06-26 | 773 |
| 205 | JPCA SHOW 2023 Exhibition and Events | 관리자 | 2023-06-07 | 420 |
| 204 | MOU with JOONGWOO TECHNOLOGY | 관리자 | 2023-05-09 | 451 |
| 203 | Inter-departmental KICK-OFF workshop for material parts development project | 관리자 | 2023-04-24 | 920 |
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관리자 2023-07-24 Hit 937
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관리자 2023-07-24 Hit 422
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관리자 2023-07-19 Hit 848
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관리자 2023-07-03 Hit 680
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관리자 2023-06-26 Hit 419
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관리자 2023-06-26 Hit 1,335
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관리자 2023-06-26 Hit 773
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관리자 2023-06-07 Hit 420
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관리자 2023-05-09 Hit 451
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관리자 2023-04-24 Hit 920