Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 272 | Advanced Electronic Packaging Technology and Market Seminar | 관리자 | 2024-08-30 | 1,609 |
| 271 | De facto, International Standards Forum_IPC Committee | 관리자 | 2024-08-29 | 1,185 |
| 270 | ASPS Advanced Semiconductor Packaging & Chiplet Show | 관리자 | 2024-08-28 | 861 |
| 269 | MOU with CHOSUN UNIVERSITY | 관리자 | 2024-08-26 | 509 |
| 268 | R&D mtg for Low Dk & Df material and Semiconductor BIB(Burn-In-Board) test | 관리자 | 2024-07-18 | 1,609 |
| 267 | BIB(Burn-In-Board) Workshop ; Low Dk & Df materials for BIB | 관리자 | 2024-07-16 | 566 |
| 266 | Substrate Materials Technology Development Project for High-Speed CCL - Wor... | 관리자 | 2024-07-08 | 1,320 |
| 265 | IEC TC91 Experts Meeting_240620 | 관리자 | 2024-07-01 | 1,225 |
| 264 | Participated in a booth at the Korea Institute of Electrical and Electronic Mate... | 관리자 | 2024-06-28 | 591 |
| 263 | R&D Workshop on the Development of Substrate Materials Technology for Ultra-High-... | 관리자 | 2024-06-25 | 1,109 |
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관리자 2024-08-30 Hit 1,609
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관리자 2024-08-29 Hit 1,185
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관리자 2024-08-28 Hit 861
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관리자 2024-08-26 Hit 509
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관리자 2024-07-18 Hit 1,609
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관리자 2024-07-16 Hit 566
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관리자 2024-07-08 Hit 1,320
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관리자 2024-07-01 Hit 1,225
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관리자 2024-06-28 Hit 591
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관리자 2024-06-25 Hit 1,109