Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 259 | 2024 IEC TC 91 Experts Meeting in June | 관리자 | 2024-06-18 | 1,068 |
| 258 | 2024 JIC Conference, Tokyo, Japan | 관리자 | 2024-06-18 | 1,325 |
| 257 | MOU with HKPCA | 관리자 | 2024-05-17 | 604 |
| 256 | MOU with SMTA, Surface Mount Technology Association | 관리자 | 2024-05-10 | 689 |
| 255 | [NEWS] KPIA Packaging Integration Seminars at Coex in April 25-26 | 관리자 | 2024-04-29 | 1,553 |
| 254 | 2024 Korea Electronic Manufacturing Industry Exhibition | 관리자 | 2024-04-29 | 506 |
| 253 | KPIA technology and market seminar II | 관리자 | 2024-04-29 | 1,504 |
| 252 | KPIA technology and market seminar I | 관리자 | 2024-04-29 | 1,373 |
| 251 | R&D Workshop on Substrate Material Technology Development Project for High-Speed | 관리자 | 2024-03-27 | 1,290 |
| 250 | Korea-Japan Experts Meeting for Advanced Packaging Integration R&D Meeting | 관리자 | 2024-02-29 | 1,251 |
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관리자 2024-06-18 Hit 1,068
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관리자 2024-06-18 Hit 1,325
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관리자 2024-05-17 Hit 604
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관리자 2024-05-10 Hit 689
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관리자 2024-04-29 Hit 1,553
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관리자 2024-04-29 Hit 506
-
관리자 2024-04-29 Hit 1,504
-
관리자 2024-04-29 Hit 1,373
-
관리자 2024-03-27 Hit 1,290
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관리자 2024-02-29 Hit 1,251