Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 199 | [KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar II | 관리자 | 2023-04-17 | 624 |
| 198 | [KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar I] | 관리자 | 2023-04-17 | 697 |
| 197 | IEC TC91 De facto Standard (IPC) Forum Steering Committee | 관리자 | 2023-04-06 | 548 |
| 196 | MOTIE R&D project KICK-OFF workshop for material development | 관리자 | 2023-02-24 | 284 |
| 195 | em |
관리자 | 2023-01-19 | 552 |
| 194 | [Inter-departmental workshop for material parts development project] | 관리자 | 2022-12-23 | 254 |
| 193 | 2022 COSD Project Results | 관리자 | 2022-12-22 | 250 |
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 440 |
| 191 | [Mounting Technology Symposium] Semiconductor Convergence Components Mounting Te... | 관리자 | 2022-11-07 | 658 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 546 |
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관리자 2023-04-17 Hit 624
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관리자 2023-04-17 Hit 697
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관리자 2023-04-06 Hit 548
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관리자 2023-02-24 Hit 284
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관리자 2023-01-19 Hit 552
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관리자 2022-12-23 Hit 254
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관리자 2022-12-22 Hit 250
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관리자 2022-11-16 Hit 440
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관리자 2022-11-07 Hit 658
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관리자 2022-11-01 Hit 546