Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 222 | ASPS 2023, Advanced Semiconductor Packaging Show 2023 | 관리자 | 2023-08-31 | 469 |
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 363 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 893 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 399 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 1,034 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 946 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 841 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 879 |
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 428 |
| 213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 1,326 |
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관리자 2023-08-31 Hit 469
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관리자 2023-08-29 Hit 363
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관리자 2023-08-28 Hit 893
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관리자 2023-08-16 Hit 399
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관리자 2023-07-28 Hit 1,034
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관리자 2023-07-28 Hit 946
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관리자 2023-07-27 Hit 841
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관리자 2023-07-27 Hit 879
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관리자 2023-07-25 Hit 428
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관리자 2023-07-24 Hit 1,326