Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 264 | Participated in a booth at the Korea Institute of Electrical and Electronic Mate... | 관리자 | 2024-06-28 | 565 |
| 263 | R&D Workshop on the Development of Substrate Materials Technology for Ultra-High-... | 관리자 | 2024-06-25 | 1,043 |
| 262 | GSC Korea 2024 | 관리자 | 2024-06-21 | 635 |
| 261 | Seminar on Technology, Market and Standards for Advanced Electronics Packaging | 관리자 | 2024-06-21 | 1,575 |
| 260 | JPCA SHOW 2024 | 관리자 | 2024-06-19 | 1,073 |
| 259 | 2024 IEC TC 91 Experts Meeting in June | 관리자 | 2024-06-18 | 1,306 |
| 258 | 2024 JIC Conference, Tokyo, Japan | 관리자 | 2024-06-18 | 1,556 |
| 257 | MOU with HKPCA | 관리자 | 2024-05-17 | 732 |
| 256 | MOU with SMTA, Surface Mount Technology Association | 관리자 | 2024-05-10 | 793 |
| 255 | [NEWS] KPIA Packaging Integration Seminars at Coex in April 25-26 | 관리자 | 2024-04-29 | 1,780 |
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관리자 2024-06-28 Hit 565
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관리자 2024-06-25 Hit 1,043
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관리자 2024-06-21 Hit 635
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관리자 2024-06-21 Hit 1,575
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관리자 2024-06-19 Hit 1,073
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관리자 2024-06-18 Hit 1,306
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관리자 2024-06-18 Hit 1,556
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관리자 2024-05-17 Hit 732
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관리자 2024-05-10 Hit 793
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관리자 2024-04-29 Hit 1,780