Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 274 | MOU with NOPION | 관리자 | 2024-09-23 | 541 |
| 273 | MOU with alpha Global | 관리자 | 2024-09-12 | 483 |
| 272 | Advanced Electronic Packaging Technology and Market Seminar | 관리자 | 2024-08-30 | 1,524 |
| 271 | De facto, International Standards Forum_IPC Committee | 관리자 | 2024-08-29 | 1,111 |
| 270 | ASPS Advanced Semiconductor Packaging & Chiplet Show | 관리자 | 2024-08-28 | 744 |
| 269 | MOU with CHOSUN UNIVERSITY | 관리자 | 2024-08-26 | 482 |
| 268 | R&D mtg for Low Dk & Df material and Semiconductor BIB(Burn-In-Board) test | 관리자 | 2024-07-18 | 1,556 |
| 267 | BIB(Burn-In-Board) Workshop ; Low Dk & Df materials for BIB | 관리자 | 2024-07-16 | 511 |
| 266 | Substrate Materials Technology Development Project for High-Speed CCL - Wor... | 관리자 | 2024-07-08 | 1,269 |
| 265 | IEC TC91 Experts Meeting_240620 | 관리자 | 2024-07-01 | 1,175 |
-
관리자 2024-09-23 Hit 541
-
관리자 2024-09-12 Hit 483
-
관리자 2024-08-30 Hit 1,524
-
관리자 2024-08-29 Hit 1,111
-
관리자 2024-08-28 Hit 744
-
관리자 2024-08-26 Hit 482
-
관리자 2024-07-18 Hit 1,556
-
관리자 2024-07-16 Hit 511
-
관리자 2024-07-08 Hit 1,269
-
관리자 2024-07-01 Hit 1,175