Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 341 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 850 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 378 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 992 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 903 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 799 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 837 |
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 405 |
| 213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 1,270 |
| 212 | Advanced Electronics packaging integration Technology and Market Seminar I | 관리자 | 2023-07-24 | 888 |
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관리자 2023-08-29 Hit 341
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관리자 2023-08-28 Hit 850
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관리자 2023-08-16 Hit 378
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관리자 2023-07-28 Hit 992
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관리자 2023-07-28 Hit 903
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관리자 2023-07-27 Hit 799
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관리자 2023-07-27 Hit 837
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관리자 2023-07-25 Hit 405
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관리자 2023-07-24 Hit 1,270
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관리자 2023-07-24 Hit 888