Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 423 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 1,670 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 864 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 351 |
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 401 |
| 232 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 880 |
| 231 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 888 |
| 230 | 25th Semiconductor Exgibition 2023 | 관리자 | 2023-10-30 | 401 |
| 229 | Advanced Electronic Mounting Technology and Market Seminar II | 관리자 | 2023-10-30 | 1,042 |
| 228 | Advanced electronic packaging technology and market seminar l | 관리자 | 2023-10-30 | 1,085 |
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관리자 2023-11-13 Hit 423
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관리자 2023-11-10 Hit 1,670
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관리자 2023-11-10 Hit 864
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관리자 2023-11-10 Hit 351
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관리자 2023-11-08 Hit 401
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관리자 2023-10-31 Hit 880
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관리자 2023-10-31 Hit 888
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관리자 2023-10-30 Hit 401
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관리자 2023-10-30 Hit 1,042
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관리자 2023-10-30 Hit 1,085