Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 382 |
| 238 | Inter-Ministerial Workshop on Substrate Material Technology Development Project ... | 관리자 | 2023-11-20 | 820 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 426 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 1,674 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 872 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 355 |
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 404 |
| 232 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 886 |
| 231 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 898 |
| 230 | 25th Semiconductor Exgibition 2023 | 관리자 | 2023-10-30 | 404 |
-
관리자 2023-11-22 Hit 382
-
관리자 2023-11-20 Hit 820
-
관리자 2023-11-13 Hit 426
-
관리자 2023-11-10 Hit 1,674
-
관리자 2023-11-10 Hit 872
-
관리자 2023-11-10 Hit 355
-
관리자 2023-11-08 Hit 404
-
관리자 2023-10-31 Hit 886
-
관리자 2023-10-31 Hit 898
-
관리자 2023-10-30 Hit 404