Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 263 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 704 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 305 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 851 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 752 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 655 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 691 |
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 328 |
| 213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 1,121 |
| 212 | Advanced Electronics packaging integration Technology and Market Seminar I | 관리자 | 2023-07-24 | 747 |
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관리자 2023-08-29 Hit 263
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관리자 2023-08-28 Hit 704
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관리자 2023-08-16 Hit 305
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관리자 2023-07-28 Hit 851
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관리자 2023-07-28 Hit 752
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관리자 2023-07-27 Hit 655
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관리자 2023-07-27 Hit 691
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관리자 2023-07-25 Hit 328
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관리자 2023-07-24 Hit 1,121
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관리자 2023-07-24 Hit 747