Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 227 | Technology market and standards seminar by electronics industry | 관리자 | 2023-10-30 | 718 |
| 226 | 2023 COSD regular meeting | 관리자 | 2023-09-25 | 289 |
| 225 | Korea-Japan Cooperation meeting | 관리자 | 2023-09-18 | 285 |
| 224 | MOU with MK Chem and Tech | 관리자 | 2023-09-07 | 298 |
| 223 | MOU with TLB | 관리자 | 2023-09-05 | 321 |
| 222 | ASPS 2023, Advanced Semiconductor Packaging Show 2023 | 관리자 | 2023-08-31 | 322 |
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 228 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 638 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 272 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 788 |
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관리자 2023-10-30 Hit 718
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관리자 2023-09-25 Hit 289
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관리자 2023-09-18 Hit 285
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관리자 2023-09-07 Hit 298
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관리자 2023-09-05 Hit 321
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관리자 2023-08-31 Hit 322
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관리자 2023-08-29 Hit 228
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관리자 2023-08-28 Hit 638
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관리자 2023-08-16 Hit 272
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관리자 2023-07-28 Hit 788