Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 241 | MOU with KTC(Korea Testing Certification Institute) | 관리자 | 2023-12-19 | 389 |
| 240 | MOU with IEEC(Integrated Electronics Engineering Center) | 관리자 | 2023-12-18 | 337 |
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 357 |
| 238 | Inter-Ministerial Workshop on Substrate Material Technology Development Project ... | 관리자 | 2023-11-20 | 766 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 398 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 1,586 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 818 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 327 |
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 377 |
| 232 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 834 |
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관리자 2023-12-19 Hit 389
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관리자 2023-12-18 Hit 337
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관리자 2023-11-22 Hit 357
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관리자 2023-11-20 Hit 766
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관리자 2023-11-13 Hit 398
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관리자 2023-11-10 Hit 1,586
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관리자 2023-11-10 Hit 818
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관리자 2023-11-10 Hit 327
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관리자 2023-11-08 Hit 377
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관리자 2023-10-31 Hit 834