Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 294 | SMTA KOREA AG Technical Committee | 관리자 | 2025-02-24 | 988 |
| 293 | Package substrates technology experts meeting for 2.1D Packaging | 관리자 | 2025-02-24 | 983 |
| 292 | 2025 SMTA Wafer Level Packaging Symposium | 관리자 | 2025-02-19 | 1,626 |
| 291 | MOU with SIPC | 관리자 | 2025-02-14 | 286 |
| 290 | 2025 em |
관리자 | 2025-01-20 | 1,457 |
| 289 | 2024 COSD Performance Sharing Meeting | 관리자 | 2024-12-20 | 1,000 |
| 288 | R&D Workshop for Low Dk & Df material and Semiconductor BIB(Burn-In-Board) test ... | 관리자 | 2024-12-11 | 1,031 |
| 287 | R&D Workshop on the Development of Substrate Materials Technology for Ultra-High-... | 관리자 | 2024-12-09 | 1,100 |
| 286 | Training program for semiconductor packaging engineers | 관리자 | 2024-12-05 | 1,151 |
| 285 | General meeting and conference of the de facto standardization forum | 관리자 | 2024-12-04 | 1,033 |
-
관리자 2025-02-24 Hit 988
-
관리자 2025-02-24 Hit 983
-
관리자 2025-02-19 Hit 1,626
-
관리자 2025-02-14 Hit 286
-
관리자 2025-01-20 Hit 1,457
-
관리자 2024-12-20 Hit 1,000
-
관리자 2024-12-11 Hit 1,031
-
관리자 2024-12-09 Hit 1,100
-
관리자 2024-12-05 Hit 1,151
-
관리자 2024-12-04 Hit 1,033