Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 251 | Inter-Ministerial Workshop on Substrate Material Technology Development Project... | 관리자 | 2024-03-27 | 941 |
| 250 | Korea-Japan Experts Meeting for Advanced Packaging Integration R&D Meeting | 관리자 | 2024-02-29 | 922 |
| 249 | MOU, KPIA-RC3DS | 관리자 | 2024-02-29 | 401 |
| 248 | 2024 SMART SMT&PCB ASSEMBLY | 관리자 | 2024-02-26 | 367 |
| 247 | Materials and Parts Development Business Ministry of Trade, Industry and Energy ... | 관리자 | 2024-02-26 | 808 |
| 246 | Advanced electronic packaging technology and market seminar | 관리자 | 2024-02-26 | 1,702 |
| 245 | Technology market and standard trend seminar by electrical, electronic, and info... | 관리자 | 2024-02-26 | 965 |
| 244 | IEC TC91 Experts meeting | 관리자 | 2024-02-21 | 835 |
| 243 | MOU with ULSAN COLLEGE | 관리자 | 2024-01-30 | 289 |
| 242 | em |
관리자 | 2024-01-16 | 424 |
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관리자 2024-03-27 Hit 941
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관리자 2024-02-29 Hit 922
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관리자 2024-02-29 Hit 401
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관리자 2024-02-26 Hit 367
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관리자 2024-02-26 Hit 808
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관리자 2024-02-26 Hit 1,702
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관리자 2024-02-26 Hit 965
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관리자 2024-02-21 Hit 835
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관리자 2024-01-30 Hit 289
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관리자 2024-01-16 Hit 424