Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 227 |
| 238 | Inter-Ministerial Workshop on Substrate Material Technology Development Project ... | 관리자 | 2023-11-20 | 502 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 262 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 811 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 551 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 197 |
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 250 |
| 232 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 577 |
| 231 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 599 |
| 230 | 25th Semiconductor Exgibition 2023 | 관리자 | 2023-10-30 | 255 |
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관리자 2023-11-22 Hit 227
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관리자 2023-11-20 Hit 502
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관리자 2023-11-13 Hit 262
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관리자 2023-11-10 Hit 811
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관리자 2023-11-10 Hit 551
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관리자 2023-11-10 Hit 197
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관리자 2023-11-08 Hit 250
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관리자 2023-10-31 Hit 577
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관리자 2023-10-31 Hit 599
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관리자 2023-10-30 Hit 255