No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
261 | Seminar on Technology, Market and Standards for Advanced Electronics Packaging | 관리자 | 2024-06-21 | 870 |
260 | JPCA SHOW 2024 | 관리자 | 2024-06-19 | 824 |
259 | 2024 IEC TC 91 Experts Meeting in June | 관리자 | 2024-06-18 | 713 |
258 | 2024 JIC Conference, Tokyo, Japan | 관리자 | 2024-06-18 | 742 |
257 | MOU with HKPCA | 관리자 | 2024-05-17 | 415 |
256 | MOU with SMTA, Surface Mount Technology Association | 관리자 | 2024-05-10 | 445 |
255 | [NEWS] KPIA Packaging Integration Seminars at Coex in April 25-26 | 관리자 | 2024-04-29 | 1,148 |
254 | 2024 Korea Electronic Manufacturing Industry Exhibition | 관리자 | 2024-04-29 | 331 |
253 | KPIA technology and market seminar II | 관리자 | 2024-04-29 | 1,048 |
252 | KPIA technology and market seminar I | 관리자 | 2024-04-29 | 926 |