Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 672 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,341 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 651 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 1,309 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 1,299 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 641 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 649 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 684 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 1,245 |
| 83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,243 |
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관리자 2021-09-13 Hit 672
-
관리자 2021-09-13 Hit 1,341
-
관리자 2021-09-13 Hit 651
-
관리자 2021-09-13 Hit 1,309
-
관리자 2021-09-13 Hit 1,299
-
관리자 2021-09-13 Hit 641
-
관리자 2021-09-13 Hit 649
-
관리자 2021-09-13 Hit 684
-
관리자 2021-09-13 Hit 1,245
-
관리자 2021-09-13 Hit 1,243