| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 1,091 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 1,070 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 552 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 536 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 582 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 1,036 |
| 83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,020 |
| 82 | Advanced Packaging & Substrate / Standardization Seminar | 관리자 | 2021-09-13 | 1,098 |
| 81 | Signed an agreement to foster strategic human resources with KTR | 관리자 | 2021-09-13 | 540 |
| 80 | MOU with ASMPacific Technology | 관리자 | 2021-09-13 | 545 |