Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 94 | MOU with NOWTECH Co., Ltd. | 관리자 | 2021-09-13 | 653 |
| 93 | MOU with FindeaChip Co., Ltd. | 관리자 | 2021-09-13 | 652 |
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 650 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,290 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 631 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 1,264 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 1,249 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 625 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 629 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 664 |
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관리자 2021-09-13 Hit 653
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관리자 2021-09-13 Hit 652
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관리자 2021-09-13 Hit 650
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관리자 2021-09-13 Hit 1,290
-
관리자 2021-09-13 Hit 631
-
관리자 2021-09-13 Hit 1,264
-
관리자 2021-09-13 Hit 1,249
-
관리자 2021-09-13 Hit 625
-
관리자 2021-09-13 Hit 629
-
관리자 2021-09-13 Hit 664