Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 99 | Packaging Integration Standard Expert Meeting | 관리자 | 2021-09-13 | 1,019 |
| 98 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,073 |
| 97 | MOU with KIEEME | 관리자 | 2021-09-13 | 528 |
| 96 | MOU with MICROINSPECTION Co., Ltd. | 관리자 | 2021-09-13 | 538 |
| 95 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd | 관리자 | 2021-09-13 | 612 |
| 94 | MOU with NOWTECH Co., Ltd. | 관리자 | 2021-09-13 | 567 |
| 93 | MOU with FindeaChip Co., Ltd. | 관리자 | 2021-09-13 | 562 |
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 569 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,124 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 551 |
-
관리자 2021-09-13 Hit 1,019
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관리자 2021-09-13 Hit 1,073
-
관리자 2021-09-13 Hit 528
-
관리자 2021-09-13 Hit 538
-
관리자 2021-09-13 Hit 612
-
관리자 2021-09-13 Hit 567
-
관리자 2021-09-13 Hit 562
-
관리자 2021-09-13 Hit 569
-
관리자 2021-09-13 Hit 1,124
-
관리자 2021-09-13 Hit 551