Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 104 | Electronic mounting technology standard seminar | 관리자 | 2021-09-13 | 1,438 |
| 103 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,524 |
| 102 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,334 |
| 101 | Semiconductor Packaging Integration technology equipment development meeting | 관리자 | 2021-09-13 | 1,320 |
| 100 | MOU with SANICO Co., Ltd. | 관리자 | 2021-09-13 | 667 |
| 99 | Packaging Integration Standard Expert Meeting | 관리자 | 2021-09-13 | 1,188 |
| 98 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,268 |
| 97 | MOU with KIEEME | 관리자 | 2021-09-13 | 625 |
| 96 | MOU with MICROINSPECTION Co., Ltd. | 관리자 | 2021-09-13 | 629 |
| 95 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd | 관리자 | 2021-09-13 | 811 |
-
관리자 2021-09-13 Hit 1,438
-
관리자 2021-09-13 Hit 1,524
-
관리자 2021-09-13 Hit 1,334
-
관리자 2021-09-13 Hit 1,320
-
관리자 2021-09-13 Hit 667
-
관리자 2021-09-13 Hit 1,188
-
관리자 2021-09-13 Hit 1,268
-
관리자 2021-09-13 Hit 625
-
관리자 2021-09-13 Hit 629
-
관리자 2021-09-13 Hit 811