Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 109 | MOU with Reed K. Fairs | 관리자 | 2021-09-13 | 585 |
| 108 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,073 |
| 107 | Symposium Packaging Integration | 관리자 | 2021-09-13 | 1,149 |
| 106 | Intelligent semiconductor technology seminar | 관리자 | 2021-09-13 | 1,205 |
| 105 | Semiconductor technology seminar | 관리자 | 2021-09-13 | 1,197 |
| 104 | Electronic mounting technology standard seminar | 관리자 | 2021-09-13 | 1,207 |
| 103 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,260 |
| 102 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,135 |
| 101 | Semiconductor Packaging Integration technology equipment development meeting | 관리자 | 2021-09-13 | 1,146 |
| 100 | MOU with SANICO Co., Ltd. | 관리자 | 2021-09-13 | 567 |
-
관리자 2021-09-13 Hit 585
-
관리자 2021-09-13 Hit 1,073
-
관리자 2021-09-13 Hit 1,149
-
관리자 2021-09-13 Hit 1,205
-
관리자 2021-09-13 Hit 1,197
-
관리자 2021-09-13 Hit 1,207
-
관리자 2021-09-13 Hit 1,260
-
관리자 2021-09-13 Hit 1,135
-
관리자 2021-09-13 Hit 1,146
-
관리자 2021-09-13 Hit 567