Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 61 | Packaging Integration Experts Meeting | 관리자 | 2021-09-13 | 586 |
| 60 | MOU with HOJIN PLATECH Co., Ltd. | 관리자 | 2021-09-13 | 310 |
| 59 | A Ground-breaking mtg of the Technical Support Center for Semiconductor Converge... | 관리자 | 2021-09-13 | 273 |
| 58 | JKC technical experts meeting | 관리자 | 2021-09-13 | 576 |
| 57 | FOP, SiC, Packaging Technology Seminar | 관리자 | 2021-09-13 | 568 |
| 56 | MOU with Cheongju University IACF | 관리자 | 2021-09-13 | 343 |
| 55 | MOU with NEPES CO., LTD. | 관리자 | 2021-09-13 | 311 |
| 54 | MOU with GDS CO., LTD. | 관리자 | 2021-09-13 | 336 |
| 53 | MOU with FLUKE KOREA CO., LTD. | 관리자 | 2021-09-13 | 412 |
| 52 | MOU with COMS CO., LTD. | 관리자 | 2021-09-13 | 292 |
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관리자 2021-09-13 Hit 586
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관리자 2021-09-13 Hit 310
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관리자 2021-09-13 Hit 273
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관리자 2021-09-13 Hit 576
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관리자 2021-09-13 Hit 568
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관리자 2021-09-13 Hit 343
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관리자 2021-09-13 Hit 311
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관리자 2021-09-13 Hit 336
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관리자 2021-09-13 Hit 412
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관리자 2021-09-13 Hit 292