Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 61 | Packaging Integration Experts Meeting | 관리자 | 2021-09-13 | 731 |
| 60 | MOU with HOJIN PLATECH Co., Ltd. | 관리자 | 2021-09-13 | 382 |
| 59 | A Ground-breaking mtg of the Technical Support Center for Semiconductor Converge... | 관리자 | 2021-09-13 | 348 |
| 58 | JKC technical experts meeting | 관리자 | 2021-09-13 | 721 |
| 57 | FOP, SiC, Packaging Technology Seminar | 관리자 | 2021-09-13 | 705 |
| 56 | MOU with Cheongju University IACF | 관리자 | 2021-09-13 | 416 |
| 55 | MOU with NEPES CO., LTD. | 관리자 | 2021-09-13 | 386 |
| 54 | MOU with GDS CO., LTD. | 관리자 | 2021-09-13 | 409 |
| 53 | MOU with FLUKE KOREA CO., LTD. | 관리자 | 2021-09-13 | 484 |
| 52 | MOU with COMS CO., LTD. | 관리자 | 2021-09-13 | 362 |
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관리자 2021-09-13 Hit 731
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관리자 2021-09-13 Hit 382
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관리자 2021-09-13 Hit 348
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관리자 2021-09-13 Hit 721
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관리자 2021-09-13 Hit 705
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관리자 2021-09-13 Hit 416
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관리자 2021-09-13 Hit 386
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관리자 2021-09-13 Hit 409
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관리자 2021-09-13 Hit 484
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관리자 2021-09-13 Hit 362