Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 134 | MOU with KSCM | 관리자 | 2021-09-13 | 628 |
| 133 | IEC TC91 Professional Committee – Zoom | 관리자 | 2021-09-13 | 2,223 |
| 132 | MOU with skydiamond | 관리자 | 2021-09-13 | 680 |
| 131 | MOU with LEO | 관리자 | 2021-09-13 | 632 |
| 130 | Symposium Packaging Integration | 관리자 | 2021-09-13 | 1,446 |
| 129 | Inter-ministerial KICK-OFF workshop for materials and parts development business | 관리자 | 2021-09-13 | 724 |
| 128 | JDA with IMAGIS, NOVASEMI, ATK | 관리자 | 2021-09-13 | 622 |
| 127 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,337 |
| 126 | Material parts development business KICK-OFF workshop | 관리자 | 2021-09-13 | 617 |
| 125 | MOU with HAESUNG DS | 관리자 | 2021-09-13 | 677 |
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관리자 2021-09-13 Hit 628
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관리자 2021-09-13 Hit 2,223
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관리자 2021-09-13 Hit 680
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관리자 2021-09-13 Hit 632
-
관리자 2021-09-13 Hit 1,446
-
관리자 2021-09-13 Hit 724
-
관리자 2021-09-13 Hit 622
-
관리자 2021-09-13 Hit 1,337
-
관리자 2021-09-13 Hit 617
-
관리자 2021-09-13 Hit 677