Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 425 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 826 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 422 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 790 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 810 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 418 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 397 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 386 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 787 |
| 83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 780 |
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관리자 2021-09-13 Hit 425
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관리자 2021-09-13 Hit 826
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관리자 2021-09-13 Hit 422
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관리자 2021-09-13 Hit 790
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관리자 2021-09-13 Hit 810
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관리자 2021-09-13 Hit 418
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관리자 2021-09-13 Hit 397
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관리자 2021-09-13 Hit 386
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관리자 2021-09-13 Hit 787
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관리자 2021-09-13 Hit 780