Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 129 | Inter-ministerial KICK-OFF workshop for materials and parts development business | 관리자 | 2021-09-13 | 628 |
| 128 | JDA with IMAGIS, NOVASEMI, ATK | 관리자 | 2021-09-13 | 531 |
| 127 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,168 |
| 126 | Material parts development business KICK-OFF workshop | 관리자 | 2021-09-13 | 528 |
| 125 | MOU with HAESUNG DS | 관리자 | 2021-09-13 | 582 |
| 124 | MOU with me |
관리자 | 2021-09-13 | 548 |
| 123 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,064 |
| 122 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,123 |
| 121 | Semiconductor technology seminar | 관리자 | 2021-09-13 | 1,168 |
| 120 | Chungbuk Semiconductor Industry Council | 관리자 | 2021-09-13 | 1,057 |
-
관리자 2021-09-13 Hit 628
-
관리자 2021-09-13 Hit 531
-
관리자 2021-09-13 Hit 1,168
-
관리자 2021-09-13 Hit 528
-
관리자 2021-09-13 Hit 582
-
관리자 2021-09-13 Hit 548
-
관리자 2021-09-13 Hit 1,064
-
관리자 2021-09-13 Hit 1,123
-
관리자 2021-09-13 Hit 1,168
-
관리자 2021-09-13 Hit 1,057