Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 623 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 322 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 600 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 624 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 318 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 296 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 288 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 586 |
| 83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 580 |
| 82 | Advanced Packaging & Substrate / Standardization Seminar | 관리자 | 2021-09-13 | 632 |
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관리자 2021-09-13 Hit 623
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관리자 2021-09-13 Hit 322
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관리자 2021-09-13 Hit 600
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관리자 2021-09-13 Hit 624
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관리자 2021-09-13 Hit 318
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관리자 2021-09-13 Hit 296
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관리자 2021-09-13 Hit 288
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관리자 2021-09-13 Hit 586
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관리자 2021-09-13 Hit 580
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관리자 2021-09-13 Hit 632