Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 784 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 400 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 746 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 764 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 397 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 372 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 362 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 738 |
| 83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 724 |
| 82 | Advanced Packaging & Substrate / Standardization Seminar | 관리자 | 2021-09-13 | 773 |
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관리자 2021-09-13 Hit 784
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관리자 2021-09-13 Hit 400
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관리자 2021-09-13 Hit 746
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관리자 2021-09-13 Hit 764
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관리자 2021-09-13 Hit 397
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관리자 2021-09-13 Hit 372
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관리자 2021-09-13 Hit 362
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관리자 2021-09-13 Hit 738
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관리자 2021-09-13 Hit 724
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관리자 2021-09-13 Hit 773