Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 144 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2021-12-03 | 637 |
| 143 | 2021-2 IEC TC91 International Standard Meeting | 관리자 | 2021-11-24 | 1,127 |
| 142 | MOU with JPCA | 관리자 | 2021-11-15 | 656 |
| 141 | Advanced Packaging Integration Technology international symposium ('21.11/09-10) | 관리자 | 2021-11-15 | 2,042 |
| 140 | [Mounting Technology Seminar] 5G&6G Communication Parts and Materials Mounting T... | 관리자 | 2021-10-29 | 1,585 |
| 139 | MOU with Yole | 관리자 | 2021-10-13 | 655 |
| 138 | MOU with Hanbat University | 관리자 | 2021-09-27 | 630 |
| 137 | MOU with KSCM | 관리자 | 2021-09-27 | 646 |
| 136 | Semiconductor Packaging Integration Technology Seminar | 관리자 | 2021-09-15 | 1,459 |
| 135 | Electronics technology standard seminar | 관리자 | 2021-09-15 | 1,408 |
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관리자 2021-12-03 Hit 637
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관리자 2021-11-24 Hit 1,127
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관리자 2021-11-15 Hit 656
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관리자 2021-11-15 Hit 2,042
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관리자 2021-10-29 Hit 1,585
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관리자 2021-10-13 Hit 655
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관리자 2021-09-27 Hit 630
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관리자 2021-09-27 Hit 646
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관리자 2021-09-15 Hit 1,459
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관리자 2021-09-15 Hit 1,408