Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 260 | 2024 IEC TC 91 Experts Meeting in June | 관리자 | 2024-06-18 | 425 |
| 259 | 2024 JIC Conference, Tokyo, Japan | 관리자 | 2024-06-18 | 338 |
| 258 | MOU with HKPCA | 관리자 | 2024-05-17 | 292 |
| 257 | MOU with SMTA, Surface Mount Technology Association | 관리자 | 2024-05-10 | 305 |
| 256 | [NEWS] KPIA Packaging Integration Seminars at Coex in April 25-26 | 관리자 | 2024-04-29 | 821 |
| 255 | 2024 Korea Electronic Manufacturing Industry Exhibition | 관리자 | 2024-04-29 | 208 |
| 254 | KPIA technology and market seminar II | 관리자 | 2024-04-29 | 682 |
| 253 | KPIA technology and market seminar I | 관리자 | 2024-04-29 | 629 |
| 252 | Inter-Ministerial Workshop on Substrate Material Technology Development Project... | 관리자 | 2024-03-27 | 669 |
| 251 | Korea-Japan Experts Meeting for Advanced Packaging Integration R&D Meeting | 관리자 | 2024-02-29 | 634 |
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관리자 2024-06-18 Hit 425
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관리자 2024-06-18 Hit 338
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관리자 2024-05-17 Hit 292
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관리자 2024-05-10 Hit 305
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관리자 2024-04-29 Hit 821
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관리자 2024-04-29 Hit 208
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관리자 2024-04-29 Hit 682
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관리자 2024-04-29 Hit 629
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관리자 2024-03-27 Hit 669
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관리자 2024-02-29 Hit 634