Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 324 | MOU with AVATEC | 관리자 | 2025-09-17 | 349 |
| 323 | ASPS 2025, Advanced Semiconductor Packaging & Chiplet Show (ASPS) | 관리자 | 2025-08-29 | 399 |
| 322 | IEC TC91 Experts Meeting_250829 | 관리자 | 2025-08-29 | 635 |
| 321 | TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 2 | 관리자 | 2025-08-28 | 1,084 |
| 320 | TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 1 | 관리자 | 2025-08-27 | 1,055 |
| 319 | MOU with EHWA DIAMOND | 관리자 | 2025-08-05 | 465 |
| 318 | MOU with DAESUNG EMGINEERING | 관리자 | 2025-08-04 | 295 |
| 317 | 2025 Semiconductor Convergence Council 3nd Meeting | 관리자 | 2025-07-24 | 712 |
| 316 | Glass substrate TGV technology Seminar | 관리자 | 2025-07-24 | 1,630 |
| 315 | MOU with NNFC | 관리자 | 2025-07-18 | 255 |
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관리자 2025-09-17 Hit 349
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관리자 2025-08-29 Hit 399
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관리자 2025-08-29 Hit 635
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관리자 2025-08-28 Hit 1,084
-
관리자 2025-08-27 Hit 1,055
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관리자 2025-08-05 Hit 465
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관리자 2025-08-04 Hit 295
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관리자 2025-07-24 Hit 712
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관리자 2025-07-24 Hit 1,630
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관리자 2025-07-18 Hit 255