Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 271 | Advanced Electronic Packaging Technology and Market Seminar | 관리자 | 2024-08-30 | 678 |
| 270 | De facto, International Standards Forum_IPC Committee | 관리자 | 2024-08-29 | 567 |
| 269 | ASPS Advanced Semiconductor Packaging & Chiplet Show | 관리자 | 2024-08-28 | 230 |
| 268 | MOU with CHOSUN UNIVERSITY | 관리자 | 2024-08-26 | 183 |
| 267 | BIB PCB FABRICATION RND PROJECT WS | 관리자 | 2024-07-18 | 1,009 |
| 266 | Substrate Materials Technology Development Project for High-Speed CCL - Wor... | 관리자 | 2024-07-08 | 735 |
| 265 | IEC TC91 Experts Meeting_240620 | 관리자 | 2024-07-01 | 674 |
| 264 | Participated in a booth at the Korea Institute of Electrical and Electronic Mate... | 관리자 | 2024-06-28 | 261 |
| 263 | Materials and Parts Development Project Ministry of Trade, Industry and Energy W... | 관리자 | 2024-06-25 | 521 |
| 262 | GSC Korea 2024 | 관리자 | 2024-06-21 | 302 |
-
관리자 2024-08-30 Hit 678
-
관리자 2024-08-29 Hit 567
-
관리자 2024-08-28 Hit 230
-
관리자 2024-08-26 Hit 183
-
관리자 2024-07-18 Hit 1,009
-
관리자 2024-07-08 Hit 735
-
관리자 2024-07-01 Hit 674
-
관리자 2024-06-28 Hit 261
-
관리자 2024-06-25 Hit 521
-
관리자 2024-06-21 Hit 302