Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 271 | Advanced Electronic Packaging Technology and Market Seminar | 관리자 | 2024-08-30 | 486 |
| 270 | De facto, International Standards Forum_IPC Committee | 관리자 | 2024-08-29 | 370 |
| 269 | ASPS Advanced Semiconductor Packaging & Chiplet Show | 관리자 | 2024-08-28 | 153 |
| 268 | MOU with CHOSUN UNIVERSITY | 관리자 | 2024-08-26 | 108 |
| 267 | BIB PCB FABRICATION RND PROJECT WS | 관리자 | 2024-07-18 | 820 |
| 266 | Substrate Materials Technology Development Project for High-Speed CCL - Wor... | 관리자 | 2024-07-08 | 551 |
| 265 | IEC TC91 Experts Meeting_240620 | 관리자 | 2024-07-01 | 525 |
| 264 | Participated in a booth at the Korea Institute of Electrical and Electronic Mate... | 관리자 | 2024-06-28 | 190 |
| 263 | Materials and Parts Development Project Ministry of Trade, Industry and Energy W... | 관리자 | 2024-06-25 | 375 |
| 262 | GSC Korea 2024 | 관리자 | 2024-06-21 | 229 |
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관리자 2024-08-30 Hit 486
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관리자 2024-08-29 Hit 370
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관리자 2024-08-28 Hit 153
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관리자 2024-08-26 Hit 108
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관리자 2024-07-18 Hit 820
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관리자 2024-07-08 Hit 551
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관리자 2024-07-01 Hit 525
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관리자 2024-06-28 Hit 190
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관리자 2024-06-25 Hit 375
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관리자 2024-06-21 Hit 229