Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 1,430 |
| 153 | [Packaging Integration Technology Seminar] Semiconductor Packaging Integration T... | 관리자 | 2022-04-18 | 1,431 |
| 152 | KICK-OFF workshop for materials and parts development business | 관리자 | 2022-03-23 | 634 |
| 151 | Ministry of Trade, Industry and Energy Technology Exchange Meeting | 관리자 | 2022-02-10 | 1,310 |
| 150 | International em |
관리자 | 2022-01-19 | 1,712 |
| 149 | Ph.D Min-su LEE, KPIA awarded the IEC Special Achievement Plaque by KSA and KATS | 관리자 | 2021-12-16 | 669 |
| 148 | MOU with KAMP | 관리자 | 2021-12-16 | 751 |
| 147 | Chungbuk Semiconductor Expert Forum in 2021 | 관리자 | 2021-12-13 | 1,469 |
| 146 | Electronic Mounting Technology (IEC TC91) Expert Committee | 관리자 | 2021-12-06 | 1,468 |
| 145 | Semiconductor Integrated Packaging technology Seminar ICAE2021_KIEEME | 관리자 | 2021-12-03 | 530 |
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관리자 2022-04-18 Hit 1,430
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관리자 2022-04-18 Hit 1,431
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관리자 2022-03-23 Hit 634
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관리자 2022-02-10 Hit 1,310
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관리자 2022-01-19 Hit 1,712
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관리자 2021-12-16 Hit 669
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관리자 2021-12-16 Hit 751
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관리자 2021-12-13 Hit 1,469
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관리자 2021-12-06 Hit 1,468
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관리자 2021-12-03 Hit 530