No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
89 | JKC technical committee | 관리자 | 2021-09-13 | 507 |
88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 534 |
87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 274 |
86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 245 |
85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 246 |
84 | JKC technical committee | 관리자 | 2021-09-13 | 499 |
83 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 491 |
82 | Advanced Packaging & Substrate / Standardization Seminar | 관리자 | 2021-09-13 | 546 |
81 | Signed an agreement to foster strategic human resources with KTR | 관리자 | 2021-09-13 | 262 |
80 | MOU with ASMPacific Technology | 관리자 | 2021-09-13 | 261 |