Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 99 | Packaging Integration Standard Expert Meeting | 관리자 | 2021-09-13 | 476 |
| 98 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 533 |
| 97 | MOU with KIEEME | 관리자 | 2021-09-13 | 248 |
| 96 | MOU with MICROINSPECTION Co., Ltd. | 관리자 | 2021-09-13 | 260 |
| 95 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd | 관리자 | 2021-09-13 | 291 |
| 94 | MOU with NOWTECH Co., Ltd. | 관리자 | 2021-09-13 | 267 |
| 93 | MOU with FindeaChip Co., Ltd. | 관리자 | 2021-09-13 | 253 |
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 279 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 517 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 271 |
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관리자 2021-09-13 Hit 476
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관리자 2021-09-13 Hit 533
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관리자 2021-09-13 Hit 248
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관리자 2021-09-13 Hit 260
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관리자 2021-09-13 Hit 291
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관리자 2021-09-13 Hit 267
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관리자 2021-09-13 Hit 253
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관리자 2021-09-13 Hit 279
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관리자 2021-09-13 Hit 517
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관리자 2021-09-13 Hit 271